List of Qualcomm Snapdragon systems-on-chip
This is a list of Qualcomm Snapdragon chips. Snapdragon is a family of mobile system on a chip made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.
Snapdragon S1
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| MSM7225 | 65 nm | 1 core up to 528 MHz ARM11 : 16K+16K L1, no L2 | Software rendered 2D support | Hexagon QDSP5 320 MHz | Up to 5 MP camera | LPDDR Single-channel 166 MHz | UMTS ; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | 2007 |
| MSM7625 | 65 nm | 1 core up to 528 MHz ARM11 : 16K+16K L1, no L2 | Software rendered 2D support | Hexagon QDSP5 320 MHz | Up to 5 MP camera | LPDDR Single-channel 166 MHz | CDMA ; UMTS; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | 2007 |
| MSM7227 | 65 nm | 1 core up to 800 MHz ARM11 : 16K+16K L1, 256K L2 | Adreno 200 226 MHz | Hexagon QDSP5 320 MHz | Up to 8 MP camera | LPDDR Single-channel 166 MHz | UMTS; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | 2008 |
| MSM7627 | 65 nm | 1 core up to 800 MHz ARM11 : 16K+16K L1, 256K L2 | Adreno 200 226 MHz | Hexagon QDSP5 320 MHz | Up to 8 MP camera | LPDDR Single-channel 166 MHz | CDMA/UMTS; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | 2008 |
| MSM7225A | 45 nm | 1 core up to 800 MHz Cortex-A5 : 32K+32K L1, 256K L2 | Adreno 200 245 MHz | Hexagon QDSP5 350 MHz | Up to 5 MP camera | LPDDR Single-channel 200 MHz | UMTS, MBMS; GSM | Bluetooth 4.0 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7625A | 45 nm | 1 core up to 800 MHz Cortex-A5 : 32K+32K L1, 256K L2 | Adreno 200 245 MHz | Hexagon QDSP5 350 MHz | Up to 5 MP camera | LPDDR Single-channel 200 MHz | CDMA2000 ; UMTS, MBMS; GSM | Bluetooth 4.0 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7227A | 45 nm | 1 core up to 1 GHz Cortex-A5 : 32K+32K L1, 256K L2 | Adreno 200 245 MHz | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz | UMTS, MBMS; GSM | Bluetooth 4.0 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7627A | 45 nm | 1 core up to 1 GHz Cortex-A5 : 32K+32K L1, 256K L2 | Adreno 200 245 MHz | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz | CDMA2000/UMTS, MBMS; GSM | Bluetooth 4.0 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2011 |
| MSM7225AB | 45 nm | 1 core up to 1 GHz Cortex-A5 : 32K+32K L1, 256K L2 | Adreno 200 245 MHz | Hexagon QDSP5 350 MHz | Up to 8 MP camera | LPDDR Single-channel 200 MHz | UMTS: up to 7.2 Mbit/s, MBMS; GSM | Bluetooth 4.0 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | |
| QSD8250 | 65 nm | 1 core up to 1 GHz Scorpion : 32K+32K L1, 256K L2 | Adreno 200 226 MHz | Hexagon QDSP6 600 MHz | Up to 12 MP camera | LPDDR Single-channel 400 MHz | UMTS, MBMS; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2008 |
| QSD8650 | 65 nm | 1 core up to 1 GHz Scorpion : 32K+32K L1, 256K L2 | Adreno 200 226 MHz | Hexagon QDSP6 600 MHz | Up to 12 MP camera | LPDDR Single-channel 400 MHz | CDMA2000/UMTS, MBMS; GSM | Bluetooth 2.0/2.1 ; 802.11b/g/n ; gpsOne Gen 7; USB 2.0 | Q4 2008 |
Snapdragon S2
Snapdragon S3
Snapdragon S4 series
Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012.The Snapdragon S4 were succeeded by Snapdragon 200/400 series and 600/800 series
Snapdragon S4 Play
Snapdragon S4 Plus
Snapdragon S4 Pro
Snapdragon 200 series
Snapdragon 200 (2013)
Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.The Snapdragon 212 was announced on July 28, 2015.
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8905 | 28 nm LP | 2 cores up to 1.1 GHz Cortex-A7 | Adreno 304 | Hexagon 536 | Up to 3 MP camera | LPDDR2/3 Single-channel 384 MHz | X5 LTE | Bluetooth 4.1 + BLE, 802.11n | 2017 | |
| MSM8208 | 28 nm LP | 2 cores up to 1.1 GHz Cortex-A7 | Adreno 304 | Hexagon 536 | Up to 5 MP camera | LPDDR2/3 Single-channel 400 MHz | Gobi 3G | Bluetooth 4.1 + BLE, 802.11n | 2.0 | 2014 |
| MSM8909 | 28 nm LP | 4 cores up to 1.1 GHz Cortex-A7 | Adreno 304 | Hexagon 536 | Up to 8 MP camera | LPDDR2/3 Single-channel 533 MHz | X5 LTE | Bluetooth 4.1 + BLE, 802.11n | 2.0 | 2014 |
| MSM8909AA | 28 nm LP | 4 cores up to 1.3 GHz Cortex-A7 | Adreno 304 | Hexagon 536 | Up to 8 MP camera | LPDDR2/3 Single-channel 533 MHz | X5 LTE | Bluetooth 4.1 + BLE, 802.11n | 2.0 | 2015 |
Qualcomm 215 (2019)
The Qualcomm 215 was announced on July 9, 2019.. It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| QM215 | 28 nm LP | 4 cores up to 1.3 GHz Cortex-A53 | Adreno 308 | Hexagon | Up to 13 MP camera / 8 MP dual | LPDDR3 Single-channel 672 MHz 3 GB | X5 LTE | Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 | 1.0 | Q3 2019 |
Snapdragon 400 series
The Snapdragon 400 Series is the entry-level SoC designed for budget devices. It is the successor of the Snapdragon S4 Play.Snapdragon 400 (2013)
Snapdragon 410, 412 and 415 (2014/15)
The Snapdragon 410 was announced on December 9, 2013. It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.The Snapdragon 412 was announced on July 28, 2015.
The Snapdragon 415 and the older Snapdragon 425 were announced on February 18, 2015.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| APQ8016 | 28 nm | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 450 MHz | Hexagon QDSP6 V5 | Up to 13.5 MP camera | LPDDR2/3 Single-channel 32-bit 533 MHz | - | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | 1H 2014 |
| MSM8916 | 28 nm | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 450 MHz | Hexagon QDSP6 V5 | Up to 13.5 MP camera | LPDDR2/3 Single-channel 32-bit 533 MHz | X5 LTE | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | 1H 2014 |
| MSM8916 v2 | 28 nm | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 306 450 MHz | Hexagon QDSP6 V5 | Up to 13.5 MP camera | LPDDR2/3 Single-channel 32-bit 600 MHz | X5 LTE | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | 2H 2015 |
| MSM8929 | 28 nm LP | 8 cores up to 1.4 GHz Cortex-A53 | Adreno 405 | Hexagon V50 | Up to 13 MP camera | LPDDR3 Single-channel 667 MHz | X5 LTE | Bluetooth 4.1 + BLE Bluetooth, 802.11ac Multi-User MIMO Wi-Fi, IZat Gen8C Lite GPS | 2.0 |
Snapdragon 425, 427, 430 and 435 (2015/16)
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.The Snapdragon 430 was announced on September 15, 2015.
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.
The Snapdragon 427 was announced on October 18, 2016.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8917 | 28 nm LP | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 | Hexagon 536 | Up to 16 MP camera | LPDDR3 Single-channel 667 MHz | X6 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO, IZat Gen8C | 2.0 | Q3 2016 |
| MSM8920 | 28 nm LP | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 | Hexagon 536 | Up to 16 MP camera | LPDDR3 Single-channel 667 MHz | X9 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO, IZat Gen8C | 3.0 | Q1 2017 |
| MSM8937 | 28 nm LP | 8 cores up to 1.4 GHz Cortex-A53 | Adreno 505 | Hexagon 536 | Up to 21 MP camera | LPDDR3 Single-channel 800 MHz | X6 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO, IZat Gen8C | 3.0 | Q2 2016 |
| MSM8940 | 28 nm LP | 8 cores up to 1.4 GHz Cortex-A53 | Adreno 505 | Hexagon 536 | Up to 21 MP camera | LPDDR3 Single-channel 800 MHz | X9 LTE | Bluetooth v4.1, 802.11ac with Multi-User MIMO, IZat Gen8C | 3.0 | Q4 2016 |
Snapdragon 429, 439 and 450 (2017/18)
The Snapdragon 450 was announced on June 28, 2017. Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.The Snapdragon 429 and 439 were announced on June 26, 2018. Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SDM429 | 12 nm FinFET | 4 cores up to 1.95 GHz Cortex-A53 | Adreno 504 | Hexagon 536 | Up to 16 MP camera / 8 MP dual | LPDDR3 | X6 LTE | Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0 | 3.0 | Q3 2018 |
| SDM439 | 12 nm FinFET | 4 + 4 cores | Adreno 505 | Hexagon 536 | Up to 21 MP camera / 8 MP dual | LPDDR3 | X6 LTE | Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0 | 3.0 | Q3 2018 |
| SDM450 | 14 nm LPP | 8 cores up to 1.8 GHz Cortex-A53 | Adreno 506 600 MHz | Hexagon 546 | Up to 21 MP camera / 13 MP dual | LPDDR3 Single-channel 933 MHz | X9 LTE | Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 | 3.0 | Q3 2017 |
Snapdragon 460 (2020)
The Snapdragon 460 was announced on January 20, 2020 with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SM4250-AA | 11 nm | 4 + 4 cores | Adreno 610 | Hexagon 683 | Spectra 340 | LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz | X11 LTE | Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB C | 3.0 | Q1 2020 |
Snapdragon 600 series
Snapdragon 600 (2013)
The Snapdragon 600 was announced on January 8, 2013. Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.- Display Controller: MDP 4. 2 RGB planes, 2 VIG planes, 1080p
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| APQ8064-1AA Advertised as S4 Pro | 28 nm LP | 4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | DDR3L-1600 | External | Bluetooth 4.0, 802.11a/b/g/n/ac, IZat Gen8A | 1.0 | Q1 2013 |
| APQ8064M | 28 nm LP | 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 533 MHz | External | Bluetooth 4.0, 802.11a/b/g/n/ac, IZat Gen8A | 1.0 | Q1 2013 |
| APQ8064T | 28 nm LP | 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 600 MHz | External | Bluetooth 4.0, 802.11a/b/g/n/ac, IZat Gen8A | 1.0 | Q1 2013 |
| APQ8064AB | 28 nm LP | 4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 450 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 600 MHz | External | Bluetooth 4.0, 802.11a/b/g/n/ac, IZat Gen8A | 1.0 | Q1 2013 |
Snapdragon 610, 615 and 616 (2014/15)
The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.- Hardware HEVC/H.265 decode acceleration
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8936 | 28 nm LP | 4 cores 1.7 GHz Cortex-A53 | Adreno 405 550 MHz | Hexagon V50 700 MHz | Up to 21 MP camera | LPDDR3 Single-Channel 800 MHz | X5 LTE | Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou | 2.0 | Q3 2014 |
| MSM8939 | 28 nm LP | 4 + 4 cores | Adreno 405 550 MHz | Hexagon V50 700 MHz | Up to 21 MP camera | LPDDR3 Single-Channel 800 MHz | X5 LTE | Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou | 2.0 | Q3 2014 |
| MSM8939 v2 | 28 nm LP | 4 + 4 cores | Adreno 405 550 MHz | Hexagon V50 700 MHz | Up to 21 MP camera | LPDDR3 Single-Channel 800 MHz | X5 LTE | Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou | 2.0 | Q3 2015 |
Snapdragon 617, 625 and 626 (2015/16)
The Snapdragon 617 was announced on September 15, 2015.The Snapdragon 625 was announced on February 11, 2016.
The Snapdragon 626 was announced on October 18, 2016. Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8952 | 28 nm LP | 4 + 4 cores | Adreno 405 550 MHz | Hexagon 546 | Up to 21 MP camera | LPDDR3 Single-channel 933 MHz | X8 LTE | Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0 | 3.0 | Q4 2015 |
| MSM8953 | 14 nm LPP | 8 cores up to 2.0 GHz Cortex-A53 | Adreno 506 650 MHz | Hexagon 546 | Up to 24 MP camera / 13 MP dual | LPDDR3 Single-channel 933 MHz | X9 LTE | Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 3.0 | 3.0 | Q2 2016 |
| MSM8953 Pro | 14 nm LPP | 8 cores up to 2.2 GHz Cortex-A53 | Adreno 506 650 MHz | Hexagon 546 | Up to 24 MP camera / 13 MP dual | LPDDR3 Single-channel 933 MHz | X9 LTE | Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0 | 3.0 | Q4 2016 |
Snapdragon 650 (618), 652 (620) and 653 (2015/16)
The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015. They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.The Snapdragon 653 was announced on October 18, 2016.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8956 | 28 nm HPm | 2 + 4 cores | Adreno 510 600 MHz | Hexagon V56 | Up to 21 MP camera / 13 MP dual | LPDDR3 Dual-channel 32-bit 933 MHz | X8 LTE | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | Q1 2016 |
| MSM8976 | 28 nm HPm | 4 + 4 cores | Adreno 510 600 MHz | Hexagon V56 | Up to 21 MP camera / 13 MP dual | LPDDR3 Dual-channel 32-bit 933 MHz | X8 LTE | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | Q1 2016 |
| MSM8976 Pro | 28 nm HPm | 4 + 4 cores | Adreno 510 600 MHz | Hexagon V56 | Up to 21 MP camera / 13 MP dual | LPDDR3 Dual-channel 32-bit 933 MHz | X9 LTE | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | Q4 2016 |
Snapdragon 630, 636 and 660 (2017)
Snapdragon 630, 636 and 660 are pin and software compatible.The Snapdragon 630 and Snapdragon 660 were announced on May 9, 2017.
The Snapdragon 636 was announced on October 17, 2017.
| Model Number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SDM630 | 14 nm LPP | 4 + 4 cores | Adreno 508 | Hexagon 642 | Spectra 160 | LPDDR4 Dual-channel 1333 MHz | X12 LTE | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 | 4.0 | Q2 2017 |
| SDM636 | 14 nm LPP | 4 + 4 cores | Adreno 509 | Hexagon 680 | Spectra 160 | LPDDR4 Dual-channel 1333 MHz | X12 LTE | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 | 4.0 | Q4 2017 |
| SDM660 | 14 nm LPP | 4 + 4 cores | Adreno 512 | Hexagon 680 | Spectra 160 | LPDDR4 Dual-channel 1866 MHz | X12 LTE | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 | 4.0 | Q2 2017 |
Snapdragon 632, 662, 665, 670 and 675 (2018-20)
The Snapdragon 632 was announced on June 26, 2018. Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.The Snapdragon 670 was announced on August 8, 2018. Pin and software compatible with Snapdragon 710.
The Snapdragon 675 was announced on October 22, 2018.
The Snapdragon 665 was announced on April 9, 2019.
The Snapdragon 662 was announced on January 20, 2020 with NavIC Support.
Snapdragon 690 (2020)
The Snapdragon 690 was announced on June 16, 2020.| Model Number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SM6350 | 8 nm LPP | 2 + 6 cores | Adreno 619L | Hexagon 692 | Spectra 355L | LPDDR4X dual channel up to 2133 MHz | Internal X51 5G/LTE | Bluetooth 5.1, NFC, Wi-Fi 6-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n | 4+ | H2 2020 |
Snapdragon 700 series
February 27, 2018 Qualcomm Introduces New Snapdragon 700 Mobile Platform SeriesSnapdragon 710 and 712 (2018/2019)
The Snapdragon 710 was announced on May 23, 2018. Pin and software compatible with Snapdragon 670.The Snapdragon 712 was announced on February 6, 2019.
| Model Number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SDM710 | 10 nm LPP | 2 + 6 cores | Adreno 616 | Hexagon 685 | Spectra 250 | LPDDR4X up to 8 GB, Dual-channel 16-bit, 1866 MHz | X15 LTE | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4 | Q2 2018 |
| SDM712 | 10 nm LPP | 2 + 6 cores | Adreno 616 | Hexagon 685 | Spectra 250 | LPDDR4X up to 8 GB, Dual-channel 16-bit, 1866 MHz | X15 LTE | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | Q1 2019 |
Snapdragon 720G, 730/730G and 765/765G/768G (2019/20)
The Snapdragon 730 and 730G were announced on April 9, 2019.The Snapdragon 765 and 765G were announced on December 4, 2019. The Snapdragon 765/765G were Qualcomm's first SoCs with 5G integrated modem and first 700 series SoC supporting Updateable GPU Drivers via the Play Store.
The Snapdragon 720G was announced on January 20, 2020.
The Snapdragon 768G were announced on May 10, 2020 featuring 15% faster CPU and GPU.
| Model Number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SM7125 | 8 nm LPP | 2 + 6 cores | Adreno 618 | Hexagon 692 | Spectra 350L | LPDDR4X up to 8 GB, Dual-channel 16-bit, 1866 MHz | X15 LTE | Bluetooth 5.1, NFC,NavIC, 802.11a/b/g/n/ac/ax 2x2 Wi-Fi GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4 | Q1 2020 |
| SM7150-AA, SM7150-AB | 8 nm LPP | 2 + 6 cores | Adreno 618 | Hexagon 688 | Spectra 350 with CV accelerator | LPDDR4X up to 8 GB, Dual-channel 16-bit, 1866 MHz | X15 LTE | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | Q2 2019 |
| SM7250-AA | 7 nm LPP EUV | 1 + 1 + 6 cores | Adreno 620 | Hexagon 696 5.4TOPS | Spectra 355 | LPDDR4X, Dual-channel 16-bit, 2133 MHz | Internal X52 5G/LTE | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | Q1 2020 |
| SM7250-AB | 7 nm LPP EUV | 1 + 1 + 6 cores | Adreno 620 | Hexagon 696 5.4TOPS | Spectra 355 | LPDDR4X, Dual-channel 16-bit, 2133 MHz | Internal X52 5G/LTE | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | Q1 2020 |
| SM7250-AC | 7 nm LPP EUV | 1 + 1 + 6 cores | Adreno 620 | Hexagon 696 5.4TOPS | Spectra 355 | LPDDR4X, Dual-channel 16-bit, 2133 MHz | Internal X52 5G/LTE | Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | Q2 2020 |
Snapdragon 800 series
A Snapdragon 802 chip, 8092, for use in Smart TVs, was formerly announced by Qualcomm. They later confirmed that it will not be released, as demand for processors in that market is "smaller than anticipated".Snapdragon 800, 801 and 805 (2013/14)
The Snapdragon 800 was announced on January 8, 2013.- eMMC 4.5 support
- 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache
- H.264, VP8 UHD/30fps encoding/decoding
- Up to 21 megapixel, stereoscopic 3D dual image signal processor
- Adreno 330 GPU
- USB 2.0 and 3.0
- Qualcomm Quick Charge 2.0
Notable features:
- eMMC 5.0 support
- H.265 HD/30fps software decoding
- DSDA
- Adreno 420 GPU
- * Hardware dynamic tessellation support
- * Improve H.265 support : UHD/30fps hardware decoding
- *1080p 120fps encoding and decoding
- *Full support Direct3D Feature Level 11_2 and OpenCL 1.2
- *Up to 55 megapixel,
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| APQ8074AA | 28 nm HPm | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | - | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2013 |
| MSM8274AA | 28 nm HPm | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | Gobi 3G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2013 |
| MSM8674AA | 28 nm HPm | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | Gobi 3G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AA | 28 nm HPm | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | Gobi 4G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AA v3 | 28 nm HPm | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | Gobi 4G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q3 2014 |
| APQ8074AB v3 | 28 nm HPm | 4 cores up to 2.36 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | - | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q4 2013 |
| MSM8274AB | 28 nm HPm | 4 cores up to 2.36 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | Gobi 3G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q4 2013 |
| MSM8674AB v3 | 28 nm HPm | 4 cores up to 2.36 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | Gobi 3G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2013 |
| MSM8974AB v3 | 28 nm HPm | 4 cores up to 2.36 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | Gobi 4G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q4 2013 |
| MSM8274AC v3 | 28 nm HPm | 4 cores up to 2.45 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | Gobi 3G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q2 2014 |
| MSM8974AC v3 | 28 nm HPm | 4 cores up to 2.45 GHz Krait 400 | Adreno 330 578 MHz | Hexagon QDSP6 V5 600 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | Gobi 4G | Bluetooth 4.0; 802.11n/ac ; IZat Gen8B | 2.0 | Q1 2014 |
| APQ8084 | 28 nm HPm | 4 cores up to 2.7 GHz Krait 450 | Adreno 420 600 MHz | Hexagon V50 800 MHz | Up to 55 MP camera | LPDDR3 Dual-channel 64-bit 800 MHz | External | Bluetooth 4.1; 802.11n/ac ; IZat Gen8B | 2.0 | Q1 2014 |
Snapdragon 808 and 810 (2015)
The Snapdragon 808 and 810 were announced on April 7, 2014.Snapdragon 808 notable features over its predecessor :
- ARMv8-A 64-bit architecture
- Adreno 418 GPU with support for Vulkan 1.0
- Hexagon V56 DSP
- 12-bit dual-ISP up to 21 MP
- 20 nm manufacturing technology
- CPU cluster with Cortex-A57 is Quad-core
- Adreno 430 GPU with support for Vulkan 1.0
- 14-bit dual-ISP up to 55 MP
- H.264, H.265 UHD/30fps encoding and decoding
- 4K main display support
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8992 | 20 nm | 2 + 4 cores | Adreno 418 600 MHz | Hexagon V56 800 MHz | Up to 21 MP camera | LPDDR3 Dual-channel 32-bit 933 MHz | X10 LTE | Bluetooth 4.1; 802.11ac; IZat Gen8C | 2.0 | Q3 2014 |
| MSM8994 | 20 nm | 4 + 4 cores | Adreno 430 600 MHz | Hexagon V56 800 MHz | Up to 55 MP camera | LPDDR4 Dual-channel 32-bit 1600 MHz | X10 LTE | Bluetooth 4.1; 802.11ac; IZat Gen8C | 2.0 | Q3 2014 |
| MSM8994v2 | 20 nm | 4 + 4 cores | Adreno 430 630 MHz | Hexagon V56 800 MHz | Up to 55 MP camera | LPDDR4 Dual-channel 32-bit 1600 MHz | X10 LTE | Bluetooth 4.1; 802.11ac; IZat Gen8C | 2.0 | 2015 |
Snapdragon 820 and 821 (2016)
The Snapdragon 820 was announced at the Mobile World Congress in March 2015, with the first phones featuring the SoC released in early 2016. The Snapdragon 821 was announced in July 2016. The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.Notable features over its predecessor :
- CPU features
- *Custom Kryo quad-core CPU
- *Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB
- GPU features
- *Adreno 530 GPU with support for Vulkan 1.0
- *DirectX 12, OpenCL 2.0, OpenGL ES 3.2
- DSP features
- *Hexagon 680 DSP 1st generation "AI engine"
- *Hexagon Vector eXtensions
- *All-Ways Aware™ Hub low power island
- *Neural Processing Engine
- *Halide and TensorFlow support
- *H.264, H.265 UHD/30fps encoding
- * H.264, H.265 10-bit, VP9 UHD/60fps decoding
- ISP features
- * Qualcomm Spectra™ ISP with Dual 14-bit ISPs
- * 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL
- * Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS
- * Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS
- * Throughput: 1.2GP/sec
- SOC features
- *14 nm FinFET process
- *eMMC 5.1/UFS 2.0
- *Quick Charge 3.0
- Wi-Fi ad support with external chip
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8996 Lite | 14 nm FinFET LPP | 2 + 2 cores | Adreno 530 510 MHz | Hexagon 680 1 GHz | Spectra | LPDDR4 Quad-channel 16-bit 1333 MHz | X12 LTE | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C | 3.0 | Q1 2016 |
| MSM8996 | 14 nm FinFET LPP | 2 + 2 cores | Adreno 530 624 MHz | Hexagon 680 1 GHz | Spectra | LPDDR4 Quad-channel 16-bit 1866 MHz | X12 LTE | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C | 3.0 | Q4 2015 |
| MSM8996 Pro-AB | 14 nm FinFET LPP | 2 + 2 cores | Adreno 530 624 MHz | Hexagon 680 1 GHz | Spectra | LPDDR4 Quad-channel 16-bit 1866 MHz | X12 LTE | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C | 3.0 | Q3 2016 |
| MSM8996 Pro-AC | 14 nm FinFET LPP | 2 + 2 cores | Adreno 530 653 MHz | Hexagon 680 1 GHz | Spectra | LPDDR4 Quad-channel 16-bit 1866 MHz | X12 LTE | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C | 3.0 | Q3 2016 |
Snapdragon 835 and 845 (2017/18)
The Snapdragon 835 was announced on November 17, 2016.Notable features over its predecessor.
- CPU features
- *Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors
- *4 Kryo 280 Gold
- **L1 cache: 64 kB + 64 kB
- **L2 cache: 2 MB
- * 4 Kryo 280 Silver
- *LPDDR4X in dual-channel mode, up to 1866MHz
- GPU features
- *Adreno 540 graphics with support for Vulkan 1.1, DirectX 12, OpenCL 2.0 and OpenGL ES 3.2
- *Quad-Core GPU @ 710/670 MHz with 512 ALUs, 16 TMUs and 12 ROPs
- *@ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s
- *@ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s
- *Qualcomm Q-Sync and Adreno Foveation
- DSP features
- *Hexagon 682 DSP 2nd generation "AI engine"
- *Hexagon Vector eXtensions
- *All-Ways Aware™ Hub low power island
- *Neural Processing Engine
- *Halide and TensorFlow support
- *H.264, H.265, VP9 UHD/30fps encoding and UHD/60fps 10-bit decoding
- *High-dynamic-range video support/Ultra HD Premium
- *DSD and 32-bit/384kHz PCM audio support with WCD9341 codec
- ISP features:
- *Qualcomm Spectra™ 180 ISP with Dual 14-bit ISPs
- * Single Camera, 30fps: Up to 32 MP
- * 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL
- * Video Capture: Up to 4K Ultra HD video capture @ 30FPS
- * Video Playback: Up to 4K Ultra HD video playback
- * Codec Support: H.265, H.264, VP9
- Modem and Wireless features
- *Snapdragon X16 LTE modem
- **Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM
- **Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm® Snapdragon™ Upload+
- *802.11a/b/g/n/ac/ad Wi-Fi connectivity
- *Bluetooth 5.0
- SOC features
- *10 nm FinFET LPE
- *Die size: 72.3mm²
- *UFS 2.1, SD 3.0
- *DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
- *Qualcomm Quick Charge 4
Snapdragon 845's notable features:
- CPU features
- *Samsung 10nm FinFET Low-Power Plus fabrication
- *4 Kryo 385 Gold
- **L1 cache: 64 KB + 64 KB
- **L2 cache: 256 KB
- *4 Kryo 385 Silver
- *DynamIQ with 2 MiB L3 cache
- 3 MiB system-level cache for CPU, GPU, DSP...
- GPU features
- *Adreno 630 graphics with support for Vulkan 1.1, DirectX 12, OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality
- *Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs
- *727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s
- *Inside-out Room-Scale 6DoF with simultaneous localization and mapping
- *Advanced visual inertial odometry And Adreno Foveation
- *Support for HDR10 and Hybrid Log-Gamma
- *DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
- DSP features
- *Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second
- *Hexagon Vector eXtensions
- *All-Ways Aware™ Hub low power island
- *Neural Processing Engine
- *Caffe, Caffe2, Halide and TensorFlow support
- *4K Ultra HD @ 60 FPS, 2x 2400x2400 @ 120 FPS
- *Can record 240 FPS in 1080p and 480 FPS in 720p
- *10-bit color depth on H.264, H.265 and VP9
- *BT.2020 support on DSP and GPU
- ISP features:
- *Qualcomm Spectra™ 280 ISP with Dual 14-bit ISPs
- *192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
- Modem and Wireless features
- *Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
- *Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
- *Bluetooth enhancements
- *Ultra-low power wireless earbuds
- *Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
- *Wi-Fi ad 60 GHz with external Module
- *Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS
- System on a chip features
- *10 nm FinFET LPP
- *Die size: 94 mm²
- *Secure Vault
- *Qualcomm Quick Charge 4+
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8998 | 10 nm FinFET LPE | 4 + 4 cores | Adreno 540 710/670 MHz | Hexagon 682 | Spectra 180 | LPDDR4X Dual-channel 32-bit 1866 MHz | X16 LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4.0 | Q2 2017 |
| SDM845 | 10 nm FinFET LPP | 4 + 4 cores | Adreno 630 710 MHz | Hexagon 685 | Spectra 280 | LPDDR4X Quad-channel 16-bit 1866 MHz | X20 LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4+ | Q1 2018 |
Snapdragon 855 and 855+ (2019)
The Snapdragon 855 was announced on December 5, 2018.The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.
Notable features over its predecessor :
- 7 nm process
- Die size: 73 mm²
- Support up to 16 GB LPDDR4X 2133 MHz support
- 4x 16-bit memory bus,
- NVM Express 2x 3.0
- CPU features
- *1 Kryo 485 Prime, up to 2.84 GHz. Prime core with 512 KB pL2
- *3 Kryo 485 Gold, up 2.42 GHz. Performance cores with 256 KB pL2 each
- *4 Kryo 485 Silver, up 1.8 GHz. Efficiency cores with 128 KB pL2 each
- *DynamIQ with 2 MB sL3 cache
- 3 MB system-level cache
- GPU features
- *Adreno 640 GPU with support for Vulkan 1.1
- *Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs
- *954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth
- *HDR gaming
- *120 fps gaming
- *Improvement on hardware-accelerated H.265 and VP9 decoder
- *HDR playback codec support for HDR10+, HDR10, HLG and Dolby Vision
- *Volumetric VR video playback
- *8K 360 VR video playback
- *Quarterly GPU driver updates via Google Play Store
- *Android GPU Inspector Tool
- DSP features
- *Hexagon 690 4th generation "AI engine" with greater than 7 trillion operations per second
- *Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions
- *Qualcomm Hexagon Tensor Accelerator
- *Qualcomm Hexagon Voice Assistant
- *All-Ways Aware™ Hub
- *Caffe, Caffe2, Halide and TensorFlow support
- *Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance
- ISP features:
- *Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
- *192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL
- *HEIF photo capture support
- *Tri-core hardware CV functions including object detection & tracking, and stereo depth processing
- *Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array HDR
- *4K 60 FPS HDR video with real-time object segmentation features HDR10, HDR10+ and HLG with Portrait Mode, 10-bit color depth and Rec. 2020 color gamut
- *Up to 1.32 Gpixel/s
- * Video Capture Formats: HDR10, HLG
- * Video Codec Support: H.265, H.264, HLG, HDR10, HDR10+, VP8, VP9
- Modem and Wireless features:
- *Internal X24 LTE Modem
- *Download: 2000 Mbit/s DL, 7x20 MHz CA, 256-QAM, 4x4 MIMO
- *Upload: 316 Mbit/s UL, 3x20 MHz CA, 256-QAM
- *External Snapdragon X50 : 5000 Mbit/s DL
- *Qualcomm Wi-Fi 6-ready mobile platform:
- **Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
- **Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz
- **MIMO Configuration: 2x2 • MU-MIMO• Dual-band simultaneous
- **Key Features: 8x8 sounding, Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
- *Qualcomm 60 GHz Wi-Fi mobile platform
- **Wi-Fi Standards: 802.11ad, 802.11ay
- **Wi-Fi Spectral Band: 60 GHz
- **Peak speed: 10 Gbit/s
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SM8150 | 7 nm | Kryo 485 1 + 3 + 4 cores | Adreno 640 585 MHz | Hexagon 690 | Spectra 380 | LPDDR4X Quad-channel 16-bit 2133 MHz | Internal: X24 LTE External: X50 5G | Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1, UFS 3.0 | 4+ | Q1 2019 |
| SM8150-AC | 7 nm | Kryo 485 1 + 3 + 4 cores | Adreno 640 ~675 MHz | Hexagon 690 | Spectra 380 | LPDDR4X Quad-channel 16-bit 2133 MHz | Internal: X24 LTE External: X50 5G | Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1, UFS 3.0 | 4+ | Q3 2019 |
Snapdragon 865 and 865+ (2020)
The Snapdragon 865 was announced on December 4, 2019.Notable features over its predecessor :
- second gen 7 nm process
- Support up to 16 GB LPDDR5 2750 MHz or LPDDR4X 2133 MHz support
- 4x 16-bit memory bus,
- NVM Express 2x 3.0
- CPU features
- * 1 Kryo 585 Prime, up to 2.84 GHz. Prime core with 512 KB pL2
- * 3 Kryo 585 Gold, up 2.42 GHz. Performance cores with 256 KB pL2 each
- * 4 Kryo 585 Silver, up 1.8 GHz. Efficiency cores with 128 KB pL2 each
- * DynamIQ with 4 MB sL3,
- * 25% performance uplift and 25% power efficiency improvement
- 3 MB system-level cache
- GPU features
- *Adreno 650 GPU with support for Vulkan 1.1
- * 50% more ALUs and ROPs
- * 25% faster graphics rendering and 35% more power efficient
- * Quarterly GPU driver updates via Google Play Store
- *Android GPU Inspector Tool
- * Desktop Forward Rendering
- DSP features
- * Hexagon 698 5th generation "AI engine" capable of 15 trillion operations per second
- * Quad-core Qualcomm Hexagon Tensor Accelerator
- * Deep learning bandwidth compression
- ISP features:
- * Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
- * 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL
- * 8K 30 FPS and 4K 120 FPS HDR video
- * Up to 2 Gpixel/s
- * Video capture formats: Dolby Vision, HDR10, HDR10+, HEVC
- * Video codec support: Dolby Vision, H.265, HDR10+, HLG, HDR10, H.264, VP8, VP9
- * New functionalities to improve noise reduction and local contrast enhancements
- Modem and wireless features:
- * External X55 LTE Modem
- * Modes: NSA, SA, TDD, FDD
- * 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
- * 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
- * 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL
- * 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
- * LTE download: 2500 Mbit/s DL, 7x20 MHz CA, 1024-QAM, 4x4 MIMO
- * LTE upload: 316 Mbit/s UL, 3x20 MHz CA, 256-QAM
- * Dynamic Spectrum Sharing
- * Qualcomm Wi-Fi 6-ready mobile platform:
- ** Qualcomm FastConnect 6800
- ** Wi-Fi standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
- ** Wi-Fi spectral bands: 2.4 GHz, 5 GHz • channel utilization: 20/40/80 MHz
- ** MIMO configuration: 2x2 • MU-MIMO • Dual-band simultaneous
- ** Key features: 8x8 sounding, Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
- * Qualcomm 60 GHz Wi-Fi mobile platform
- ** Wi-Fi Standards: 802.11ad, 802.11ay
- ** Wi-Fi spectral band: 60 GHz
- ** Peak speed: 10 Gbit/s
- Other features:
- * Secure Processing Unit with integrated dual-SIM dual-standby support
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| SM8250 | 7 nm | Kryo 585 1 + 3 + 4 cores | Adreno 650 587MHz | Hexagon 698 | Spectra 480 | LPDDR5 Quad-channel 16-bit 2750 MHz or LPDDR4X Quad-channel 16-bit 2133 MHz | Internal: no External: X55 5G/LTE | Bluetooth 5.1; 802.11a/b/g/n/ac/ax up to 1774 Mbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 GB/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 5 | Q1 2020 |
| SM8250-AB | 7 nm | Kryo 585 1 + 3 + 4 cores | Adreno 650 645MHz | Hexagon 698 | Spectra 480 | LPDDR5 Quad-channel 16-bit 2750 MHz or LPDDR4X Quad-channel 16-bit 2133 MHz | Internal: no External: X55 5G/LTE | Bluetooth 5.2; 802.11a/b/g/n/ac/ax up to 3.6Gbps; 802.11ad/ay 60 GHz Wi-Fi up to 10 GB/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 5 | Q3 2020 |
Snapdragon Compute Platforms for Windows 10 PCs
Snapdragon 835, 850, 7c, 8c, 8cx and SQ1
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.
It is essentially an over-clocked version of the Snapdragon 845.
The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.
Notable features over the 855:
- 10 MB L3 cache
- 8x 16-bit memory bus,
- NVM Express 4x
The Snapdragon 7c Compute Platform and Snapdragon 8c Compute Platform for Windows 10 PCs were announced on December 5, 2019.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| MSM8998 | 10 nm FinFET LPE | 4 + 4 cores | Adreno 540 710/670 MHz | Hexagon 682 | Spectra 180 | LPDDR4X Dual-channel 32-bit 1866 MHz | X16 LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4.0 | Q2 2018 |
| SDM850 | 10 nm FinFET LPP | 4 + 4 cores | Adreno 630 710 MHz | Hexagon 685 | Spectra 280 | LPDDR4X Quad-channel 16-bit 1866 MHz | X20 LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4+ | Q3 2018 |
| 7c | 8 nm | Kryo 468 up to 2.4 GHz | Adreno 618 | Hexagon 692 | Spectra 255 | LPDDR4X Dual-channel 16-bit 2133 MHz | X15 LTE | Bluetooth 5.1; 802.11a/b/g/n/ac/ad/ax; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 | 2020 | |
| 8c | 7 nm | Kryo 490 4 + 4 cores | Adreno 675 | Hexagon 690 | Spectra 390 | LPDDR4X Quad-channel 16-bit 2133 MHz | Internal: X24 LTE External: X55 5G/LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | 2020 |
| 8cx | 7 nm | Kryo 495 4 + 4 cores | Adreno 680 | Hexagon 690 | Spectra 390 | LPDDR4X Octa-channel 16-bit 2133 MHz | Internal: X24 LTE External: X55 5G/LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q3 2019 |
| Microsoft SQ1 | 7 nm | Kryo 495 4 + 4 cores | Adreno 685 | Hexagon 690 | Spectra 390 | LPDDR4X Octa-channel 16-bit 2133 MHz | Internal: X24 LTE External: X55 5G/LTE | Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q3 2019 |
Hardware codec supported
The different video codecs supported by the snapdragon SoCs.D - decode; E - encode
FHD = FullHD = 1080p = 1920x1080px
HD = 720p which can be 1366x768px or 1280x720px
Snapdragon 200 series
The different video codecs supported by the snapdragon 200 series.| Codec | Snapdragon 200 | Snapdragon 200 | Qualcomm 205 | Snapdragon 208/210 | Snapdragon 212 |
| Availability | 2013 | 2013 | 2017 | 2014 | 2015 |
| Hexagon | QDSP5 | QDSP6 | 536 | 536 | 536 |
| H263 | |||||
| VC-1 | |||||
| H.264 | |||||
| H.264 10-bit | |||||
| VP8 | |||||
| H.265 | |||||
| H.265 10-bit | |||||
| H.265 12-bit | |||||
| VP9 | |||||
| VP9 10-bit | |||||
| AV1 |
Snapdragon 400 series
The different video codecs supported by the snapdragon 400 series.| Codec | Snapdragon 400 | Snapdragon 410/415 | Snapdragon 429/439 | Snapdragon 450 |
| Availability | Q4 2013 | 2014/2015 | Q2 2018 | Q2 2017 |
| Hexagon | QDSP6 | QDSP6 V5 | 536 | 546 |
| H263 | ||||
| VC-1 | ||||
| H.264 | ||||
| H.264 10-bit | ||||
| VP8 | ||||
| H.265 | ||||
| H.265 10-bit | ||||
| H.265 12-bit | ||||
| VP9 | ||||
| VP9 10-bit | ||||
| AV1 |
Snapdragon 600 series
The different video codecs supported by the snapdragon 600 series.| Codec | Snapdragon 600 | Snapdragon 610 | Snapdragon 650/652/653 | Snapdragon 630 | Snapdragon 632 | Snapdragon 636/660 |
| Availability | Q1 2013 | Q1 2015 | Q2 2018 | |||
| Hexagon | QDSP6 V4 | QDSP6 V50 | QDSP6 V56 | 642 | 546 | 680 |
| H263 | ||||||
| VC-1 | ||||||
| H.264 | ||||||
| H.264 10-bit | ||||||
| VP8 | ||||||
| H.265 | ||||||
| H.265 10-bit | ||||||
| VP9 | ||||||
| VP9 10-bit | ||||||
| AV1 | ||||||
| Video frame rate support Decoding | HD 60 fps | HD 120 fps | HD 240 fps | HD 240fps | HD 240 fps | |
| Video frame rate support Decoding | FHD 30 fps | FHD 60 fps | FHD 120 fps | FHD 120 fps | FHD 120 fps | FHD 120 fps |
| Video frame rate support Decoding | No 4K | No 4K | 4K30 fps | 4K30 | 4K30 fps | 4K30 |
| Video frame rate support Encoding | HD 60 fps | HD 60 fps | HD 240 fps | HD 240 fps | HD 240 fps | |
| Video frame rate support Encoding | FHD 30 fps | FHD 30 fps | FHD 120 fps | FHD 120 fps | FHD 120 fps | FHD 120 fps |
| Video frame rate support Encoding | No 4K | No 4K | 4K30 fps | 4K30 | 4K30 fps | 4K30 |
Snapdragon 700 series
The different video codecs supported by the snapdragon 700 series.| Codec | Snapdragon 710 | Snapdragon 720G | Snapdragon 765G |
| Availability | TBA | Q1 2020 | |
| Hexagon | 685 | 692 | |
| H263 | |||
| VC-1 | |||
| H.264 | |||
| H.264 10-bit | |||
| VP8 | |||
| H.265 | |||
| H.265 10-bit | |||
| H.265 12-bit | |||
| VP9 | |||
| VP9 10-bit | |||
| AV1 | |||
| Video frame rate support Decoding | HD 240 fps | HD 240 fps | |
| Video frame rate support Decoding | FHD 120 fps | FHD 120 fps | |
| Video frame rate support Decoding | 4K 30fps | 4K 30fps | |
| Video frame rate support Encoding | HD 240 fps | HD 240 fps | |
| Video frame rate support Encoding | FHD 120 fps | FHD 120 fps | |
| Video frame rate support Encoding | 4K 30fps | 4K 30fps | |
| Others | HDR10 | HDR10, HLG |
Snapdragon 800 series
The different video codecs supported by the Snapdragon 800 series.Wearable platforms
Snapdragon Wear series
The Qualcomm Snapdragon Wear 2100 processor is designed for smartwatches. It is available in both connected and tethered versions.The LG Watch Style uses this processor.
The Snapdragon Wear 2500 was announced on June 26, 2018.
The Snapdragon Wear 3100 was announced on September 10, 2018.
The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020. The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.
| Model number | Fab | CPU | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
| Wear 1100 | 28 nm LP | 1 core up to 1.2 GHz Cortex-A7 | Fixed Function GPU | LPDDR2 | Integrated 2G/3G/LTE | Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2016 | |
| Wear 1200 | 28 nm LP | 1 core up to 1.3 GHz Cortex-A7 | Fixed Function GPU | LPDDR2 | Integrated 2G/LTE | Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2017 | |
| MSM8909w | 28 nm LP | 4 cores up to 1.2 GHz Cortex-A7 | Adreno 304 | Hexagon | LPDDR3 400 MHz | X5 2G/3G/LTE | Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou | Q1 2016 |
| SDM429w | 12 nm | 4 cores up to 1.7 GHz Cortex-A53 | Adreno 504 | Hexagon QDSP6 V56 | LPDDR3 750 MHZ | X5 2G/3G/LTE | Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou | Q2 2020 |
Automotive platforms
Snapdragon 602A and 820A
The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014.The Snapdragon 820A was announced on January 6, 2016.
| Model number | Fab | CPU | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
| 8064-AU | 28 nm LP | 4 cores up to 1.5 GHz Krait 300 | Adreno 320 | Hexagon V40 600 MHz | LPDDR3 Dual-channel 32-bit 533 MHz | External Gobi 9x15 | Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 2-stream 802.11n/ac | Q1 2014 |
| MSM8996AU | 14 nm FinFET LPP | 4 cores up to 2.1 GHz Kryo | Adreno 530 | Hexagon 680 1 GHz | LPDDR4 | X12 LTE | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C |
Embedded platforms
Snapdragon 410E, 600E, 800, 810 and 820E
The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
| APQ8016E | 28 nm LP | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 | Hexagon QDSP6 V5 691 MHz | Up to 13 MP camera | LPDDR2/3 Single-channel 32-bit 533 MHz | none | Bluetooth 4.0, 802.11n, GPS | |
| APQ8064E | 28 nm LP | 4 cores up to 1.5 GHz Krait 300 | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | DDR3/DDR3L Dual-channel 533 MHz | none | Bluetooth 4.0, 802.11a/b/g/n/ac, IZat Gen8A | |
| APQ8074 | 28 nm HPm | 4 cores up to 2.3 GHz Krait 400 | Adreno 330 | Hexagon QDSP6 V5 | Up to 55 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz | none | Bluetooth 4.1; 802.11n/ac ; IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0 | |
| APQ8094 | 20 nm | 4 + 4 cores | Adreno 430 650 MHz | Hexagon V56 800 MHz | Up to 55 MP camera | LPDDR4 Dual-channel 32-bit 1600 MHz | none | Bluetooth 4.1; 802.11ac; IZat Gen8C | |
| APQ8096 | 14 nm FinFET LPP | 2 + 2 cores | Adreno 530 | Hexagon 680 825 MHz | Up to 28 MP camera | LPDDR4 Quad-channel 16-bit 1866 MHz | none | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C |
Vision Intelligence Platform
The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
| QCS603 | 10 nm LPP | 2 + 2 cores | Adreno 615 | Hexagon 685 | Spectra 270 | LPDDR4X 16-bit 1866 MHz | none | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | |
| QCS605 | 10 nm LPP | 8 cores up to 2.5 GHz Kryo 300 | Adreno 615 | Hexagon 685 | Spectra 270 | LPDDR4X 16-bit 1866 MHz | none | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ |
Home Hub and Smart Audio platforms
Qualcomm 212, 624 and Smart Audio
The Qualcomm Smart Audio Platform was announced on June 14, 2017.The Qualcomm 212 Home Hub and Qualcomm 624 Home Hub were announced on January 9, 2018.
The QCS400 Series was announced March 19, 2019.
| Model number | Fab | CPU | GPU | DSP | ISP | Audio | Memory technology | Modem | Connectivity | Sampling availability |
| APQ8009 | 28 nm LP | 4 cores up to 1.3 GHz Cortex-A7 | Adreno 304 | Hexagon 536 | Up to 16 MP camera | LPDDR2/3 Single-Channel 533 MHz | none | Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac Wi-Fi | ||
| APQ8017 | 28 nm LP | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 | Hexagon 536 | LPDDR3 Single-channel 667 MHz | none | Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac Wi-Fi | |||
| APQ8053 | 14 nm LPP | 8 cores up to 1.8 GHz Cortex-A53 | Adreno 506 | Hexagon 546 | Up to 24 MP camera / 13 MP dual | LPDDR3 | none | Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac Wi-Fi | ||
| QCS403 | Dual-core CPU | none | 2x Hexagon V66 | 12x Audio Channels Supported | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 ; Zigbee/15.4 | Q1 2019 | |||
| QCS404 | Quad-core CPU | none | 2x Hexagon V66 | 12x Audio Channels Supported | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 ; Zigbee/15.4 | Q1 2019 | |||
| QCS405 | Quad-core CPU | Adreno 506 | 2x Hexagon V66 | 12x Audio Channels Supported | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 ; Zigbee/15.4 | Q1 2019 | |||
| QCS407 | Quad-core CPU | Adreno 506 | 2x Hexagon V66 | 32x Audio Channels Supported | none | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 ; Zigbee/15.4 | Q1 2019 |
eXtended Reality (XR) platforms
Snapdragon XR1 and XR2
In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.The Snapdragon XR2 5G Platform was announced on December 5, 2019.
| Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Tracking | Connectivity | Sampling availability |
| XR1 | ? | Kryo | Adreno | Hexagon | Spectra | LPDDR4X? | 3DoF and 6DoF head and controller tracking | ? | Q1 2019 |
| XR2 | ? | Kryo | Adreno | Hexagon | Spectra | LPDDR4X? | ? | Q1 2020 |
Bluetooth SoC platforms
Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair. Qualcomm announced the QCC5100 Series at CES 2018.On January 28 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.
Qualcomm QCC300x Series Bluetooth audio SoCs
Qualcomm QCC30xx Series Bluetooth audio SoCs
| Model number | Fab | CPU | DSP | Bluetooth | Technologies support | Power consumption | DAC output / Digital microphone input | Digital Assistant activation | Sampling availability |
| QCC3020 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL TrueWireless™ Stereo Plus cVc™ audio | ~6mA | Mono / 2-mic | Button press | H1 2017 | |
| QCC3021 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL TrueWireless™ Stereo Plus cVc™ audio | ~6mA | Stereo / 1-mic | Button press | H1 2017 | |
| QCC3024 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | cVc™ audio Google Fast Pair | ~6mA | Stereo / 2-mic | Button press | H1 2017 | |
| QCC3026 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL TrueWireless™ Stereo Plus cVc™ audio | ~6mA | Mono / 2-mic | Button press | H1 2017 | |
| QCC3031 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL TrueWireless™ Stereo Plus cVc™ audio | ~6mA | Stereo / 1-mic | Button press | H1 2017 | |
| QCC3034 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL cVc™ audio Google Fast Pair | ~6mA | Mono / 2-mic | Button press | H1 2017 | |
| QCC3040 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD TrueWireless™ Mirroring ANC cVc™ audio Google Fast Pair | <5 mA | Stereo / 2-mic | Button press | H1 2020 | |
| QCC3046 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD TrueWireless™ Mirroring ANC cVc™ audio Google Fast Pair | <5 mA | Stereo / 2-mic | Button press | H1 2020 |
Qualcomm QCC510x Series Bluetooth audio SoCs
| Model number | Fab | CPU | DSP | Bluetooth | Technologies support | Power consumption | Digital Assistant activation | Sampling availability |
| QCC5120 | Dual core 32-bit application processor | Dual core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL eXtension program TrueWireless™ Stereo Plus ANC cVc™ audio Google Fast Pair | ~6mA ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm® Voice Activation | H1 2018 | |
| QCC5121 | Dual core 32-bit application processor | Dual core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL eXtension program TrueWireless™ Stereo Plus ANC cVc™ audio Google Fast Pair | ~6mA ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm® Voice Activation | H1 2018 | |
| QCC5124 | Dual core 32-bit application processor | Dual core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL eXtension program TrueWireless™ Stereo Plus ANC cVc™ audio Google Fast Pair | ~6mA ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm® Voice Activation | H1 2018 | |
| QCC5125 | Dual core 32-bit application processor | Single core Qualcomm® Kalimba™ DSP | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX™ Classic/HD/LL eXtension program TrueWireless™ Stereo Plus ANC cVc™ audio Google Fast Pair | ~10mA ~10mA HFP Narrow Band, 1 Digital MIC cVc | Button press | H1 2018 | |
| QCC5141 | Dual core 32-bit application processor | Dual core Qualcomm® Kalimba™ DSP | Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s | aptX™ Adaptive eXtension program TrueWireless™ Mirroring ANC cVc™ audio Google Fast Pair | ~5mA A2DP stream | Button press Qualcomm® Voice Activation | H1 2020 | |
| QCC5144 | Dual core 32-bit application processor | Dual core Qualcomm® Kalimba™ DSP | Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s | aptX™ Adaptive eXtension program TrueWireless™ Mirroring ANC cVc™ audio Google Fast Pair | ~5mA A2DP stream | Button press Qualcomm® Voice Activation | H1 2020 |
Related pages
- Qualcomm Adreno
- Qualcomm Hexagon
- Qualcomm Snapdragon LTE modem
- Devices using Qualcomm Snapdragon systems-on-chip
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