HiSilicon develops SoCs based on ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.
K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL smartphones and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Kirin 990 5G is HiSilicon's first SoC based on N7 nm+ FinFET technology.
Interconnect: ARM Mali-G76 MP16
Da Vinci NPU.
*Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny
*Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny
Da Vinci Lite features 3D Cube Tensor Computing Engine, Vector unit
Da Vinci Tiny features 3D Cube Tensor Computing Engine, Vector unit
Smartphone modems
HiSilicon develops smartphone modems which although not exclusively, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.
At MWC 2012 HiSilicon released the Balong 710. It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI. The Balong 710 was designed to be used with the K3V2 SoC. Its specs:
The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network. Its specs:
The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave. Its specs:
3GPP Release 15
Peak data rate up to 2.3 Gbit/s
Sub-6 GHz and mmWave
NSA/SA
DL 256QAM
Balong 5000
The Balong 5000 supports 2G, 3G, 4G, and 5G. Its specs:
2G/3G/4G/5G Multi Mode
Fully compliant with 3GPP Release 15
Sub-6 GHz: 100 MHz x 2CC CA
Sub-6 GHz:Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
mmWave:Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s
NR+LTE:Downlink up to 7.5 Gbit/s
FDD & TDD Spectrum Access
SA & NSA Fusion Network Architecture
Supports 3GPP R14 V2X
3GB LPDDR4X
Wearable SoCs
HiSilicon develops SoCs for wearables such as truly wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear and smartwatches.
Kirin A1
The Kirin A1 was announced on September 6, 2019. It features:
The Kunpeng 916 is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is utilized in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server. It features:
The Kunpeng 920 is HiSilicon's fourth generation server processor announced in 2018, launched in 2019. Huawei claim the Kunpeng 920 CPU scores more than an estimated 930 on SPECint®_rate_base2006. The Kunpeng 920 is utilized in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server and TaiShan XA320 V2 High-Density Server Node. It features:
32 to 64x custom TaiShan v110 cores at up to 2.6 GHz.
The TaiShan v110 core is a 4-way out-of-order superscalar that implements the ARMv8.2-A ISA. Huawei reports the core supports almost all the ARMv8.4-A ISA features with a few exceptions, including dot product and the FP16 FML extension.
The TaiShan v110 cores are likely a new core not based off ARM designs
Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine, Vector unit and scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks.
Ascend 310
The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16. The Ascend 310 features:
