List of Intel Atom microprocessors
The Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.
For Nettop and Netbook Atom Microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.
[Nettop] processors (small desktop)
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, hyper-threading
- These models do not support Intel VT-x or SSE4.
- Transistors: 47 million
- Die size: 25.96 mm²
- Package size: 22 mm × 22 mm
- Steppings: C0
"Pineview">Pineview (microprocessor)">Pineview" (45 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, hyper-threading
- These models do not support Intel VT-x or SSE4.
- GMA 3150 GPU and memory controller are integrated into the processor.
- Transistors: 123 million, 176 million
- Die size: 66 mm² , 87 mm²
- Package size: 22 mm × 22 mm
"Cedarview">Cedarview (microprocessor)">Cedarview" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, hyper-threading
- These models do not support SSE4.
- PowerVR-based Intel GMA 3600/GMA 3650 GPU and memory controller are integrated into the processor.
- Transistors: ?
- Die size: ?
- Package size: 22 mm × 22 mm
[Netbook] processors (sub-notebook)
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit '', hyper-threading
- These models do not support Intel 64, Intel VT-x, or SSE4.
- Transistors: 47 million
- Die size: 26 mm²
- Package size: 22 mm × 22 mm
- Steppings: C0
- The Atom N280 was used on some W-series VAIO Netbooks.
"Pineview">Pineview (microprocessor)#Pineview microprocessor">Pineview" (45 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit '', hyper-threading
- These models do not support Intel VT-x or SSE4 and are limited to 2GB of memory.
- Graphics GMA 3150 and memory controller are integrated into the processor, but graphics sometimes disabled in favor of discrete video chip.
- Transistors: 123 million, 176 million
- Die size: 66 mm² , 87 mm²
- Package size: 22 mm × 22 mm
"Cedarview">Cedarview (microprocessor)#Cedarview microprocessor">Cedarview" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit '', hyper-threading
- These models do not support Intel VT-x or SSE4.
- PowerVR-based Intel GMA 3600/GMA 3650 GPU and memory controller are integrated into the processor.
- Transistors: ? million
- Die size: ?
- Package size: 22 × 22 mm
[List of Intel [mobile Internet device platforms|MID]] processors/SoCs ([UMPC]/[Smartphone]/IoT">Internet of things">IoT)
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Silverthorne">Silverthorne (microprocessor)">Silverthorne" (45 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit
- Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Hyper-Threading and Intel VT-x
- Models Z500, Z510P, Z510PT, and Z515 support Hyper-Threading only
- Model Z515 supports Intel Burst Performance Technology''
- GMA 500 GPU and memory controller are integrated onto the processor die
- Transistors: 47 million
- Die size: 26 mm²
- Package size: 13 mm × 14 mm / 22 mm × 22 mm
- Steppings: C0
"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)
- All models support: ''MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
- GMA 600 GPU and memory controller are integrated onto the processor die
- Transistors: 140 million
- Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
- Package size: 13.8 mm × 13.8 × 1.0 mm
- Steppings: C0
"Penwell">Penwell (SoC)">Penwell" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Intel Burst Performance Technology, Hyper-threading.
- GPU and memory controller are integrated onto the processor die
- Package size: 12 mm × 12 × 1.0 mm
- Steppings: D1
- Currently used in the Motorola RAZR i smartphone.
Silvermont microarchitecture">Silvermont">Silvermont microarchitecture
"Merrifield">Silvermont">Merrifield" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology.
- Z3480 also supports Intel Wireless Display.
- GPU and memory controller are integrated onto the processor die
- Package size: 12 mm × 12 × 1.0 mm
"Moorefield">Silvermont">Moorefield" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology, Intel Wireless Display.
- GPU and memory controller are integrated onto the processor die
- Package size: 14 mm × 14 × 1.0 mm
"SoFIA">Rockchip#Tablet processors with integrated modem">SoFIA" (28 nm)
- SoFIA
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI
- GPU and memory controller are integrated onto the processor die
- Package size: 34 × 40 mm
- SoFIA 3G SoC with Silvermont CPU
- *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
- SoFIA 3G–R SoC with Silvermont CPU
- *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
- SoFIA LTE with Airmont CPU
- *Integrated LTE Cat. 4, SMARTi™ 4.5, LnP/ CG2000, PMIC
Tablet">Tablet computer#Intel tablet platforms">Tablet processors/SoCs
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)
- All models support: ''MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
- GMA 600 GPU and memory controller are integrated onto the processor die
- Transistors: 140 million
- Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
- Package size: 13.8 mm × 13.8 × 1.0 mm
- Steppings: C0
"Cloverview">Cloverview (SoC)">Cloverview" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading, Intel Burst Performance Technology .
- GPU and memory controller are integrated onto the processor die
- Package size: 13.8 mm × 13.8 × 1.0 mm
- Steppings:B1, C0
Silvermont microarchitecture">Silvermont">Silvermont microarchitecture
"Bay Trail-T">Silvermont">Bay Trail-T" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI.
- GPU and memory controller are integrated onto the processor die
- GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.1 and OpenCL 1.1.
- Package size: 17 mm × 17 × 1.0 mm
Airmont microarchitecture">Silvermont">Airmont microarchitecture
"Cherry Trail-T">Silvermont">Cherry Trail-T" (14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x2, AES-NI.
- GPU and memory controller are integrated onto the processor die
- GPU is based on 8th generation Intel HD Graphics, with 12 or 16 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.1 and OpenCL 1.2.
- Package size: 17 mm × 17 × 1.0 mm
Embedded">Embedded system">Embedded processors/SoC">System on a chip">SoCs
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Tunnel Creek">Tunnel Creek (microprocessor)">Tunnel Creek" (45 nm)
- CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, hyper-threading, Intel VT-x. It has 32K L1 Instruction Cache, 24K L1 Data Cache, 512K L2 Cache.
- Peripherals include GMA 600 GPU, memory controller, HD Audio controller, SPI controller, 4 channels of PCI Express ×1, and various legacy devices.
- Package size: 22 mm × 22 mm
- Steppings: B0
- Temperature range: for : 0°C to +70°C, for : -40°C to +85°C.
"Stellarton">Stellarton (microprocessor)">Stellarton" (45 nm)
- "Tunnel Creek" CPU with an Altera Field Programmable Gate Array
- CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, hyper-threading, Intel VT-x. It has 32K L1 Instruction Cache, 24K L1 Data Cache, 512K L2 Cache.
- Peripherals include graphics controller, memory controller, HD Audio controller, SPI controller, 4 channels of PCI Express ×1, and various legacy devices.
- Package size: 37.5 mm × 37.5 mm
- Steppings: B0
- TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
- Temperature range: for : 0°C to +70°C, for : -40°C to +85°C.
Silvermont microarchitecture">Silvermont">Silvermont microarchitecture
"Bay Trail-I">Silvermont">Bay Trail-I" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
- GPU and memory controller are integrated onto the processor die
- GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports 2 displays, DirectX 11, OpenGL 4.0, OpenGL ES 3.1 and OpenCL 1.1.
- Peripherals include USB 2.0, HD Audio controller, SATA with 2 ports, UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
- Package size: 25 mm × 27 mm
Airmont microarchitecture">Silvermont">Airmont microarchitecture
"Braswell">Silvermont">Braswell" (14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI.
- GPU and memory controller are integrated onto the processor die
- GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2.
- Package size: 25 mm × 27 mm
Goldmont microarchitecture">Goldmont">Goldmont microarchitecture
"Apollo Lake">Goldmont">Apollo Lake" (14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI, ECC memory.
- GPU and memory controller are integrated onto the processor die
- GPU is based on Skylake Intel HD Graphics, with 12 or 18 execution units, and supports HDMI 1.4, DP 1.2, and eDP 1.3.
- Package size: 24 mm × 31 mm
Server">Server (computing)">Server SoCs
Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture
"Centerton">Centerton (SoC)">Centerton" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.
"Briarwood">Briarwood (SoC)">Briarwood" (32 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.
Silvermont microarchitecture">Silvermont">Silvermont microarchitecture
"Avoton">Silvermont">Avoton" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
- Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
- Quad-core SoC peripherals include 4 × USB 2.0, 2 or 6 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
- C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
- C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
- Package size: 34 mm × 28 mm
"Rangeley">Silvermont">Rangeley" (22 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
- All models except C2x38 support Intel QuickAssist Technology
- SoC peripherals include 4 × USB 2.0, 4-6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 8-16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
- Package size: 34 mm × 28 mm
Goldmont microarchitecture">Goldmont">Goldmont microarchitecture
"Denverton">Goldmont">Denverton" (14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI, ECC memory.
- SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.
- Package size: 34 mm × 28 mm
Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture
"Snow Ridge">Tremont (microarchitecture)">Snow Ridge" (10 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
- SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100Gbps LAN, 3 × UART, and up to 32 lanes of PCI Express, in x16, x8, and x4 configurations.
- Intel Dynamic Load Balancer & Intel QuickAssist Technology
- Package size: 47.5 mm × 47.5 mm
CE">Intel Consumer Electronics">CE SoCs
Single-core CE SoCs
"Sodaville">Sodaville (SoC)">Sodaville" (45 nm)
- Package size: 27 mm × 27 mm
- GPU
"Groveland">Groveland (SoC)">Groveland" (45 nm)
- Package size: ?? mm × ?? mm
- 2 × 32-bit memory channels, up to DDR2-800
- GPU
Dual-Core CE SoCs
"Berryville">Berryville (SoC)">Berryville" (32 nm)
- Package size: ?? mm × ?? mm
- GPU for 3D
- GPU for 2D