Ivy Bridge (microarchitecture)
Ivy Bridge is the codename for the "third generation" of the Intel Core processors. Ivy Bridge is a die shrink to 22 nanometer manufacturing process based on the 32 nanometer Sandy Bridge - see tick–tock model. The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX, Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.
Ivy Bridge processors are backwards compatible with the Sandy Bridge platform, but such systems might require a firmware update. In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 to complement Ivy Bridge.
Volume production of Ivy Bridge chips began in the third quarter of 2011. Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively. Core i3 desktop processors, as well as the first 22 nm Pentium, were announced and available the first week of September 2012.
Ivy Bridge is the last Intel platform to fully support Windows XP and the earliest Intel microarchitecture to officially support Windows 10 64-bit.
Overview
The Ivy Bridge CPU microarchitecture is a shrink from Sandy Bridge and remains largely unchanged. Like its predecessor, Sandy Bridge, Ivy Bridge was also primarily developed by Intel's Israel branch, located in Haifa, Israel. Notable improvements include:- 22 nm Tri-gate transistor technology.
- A new random number generator and the RDRAND instruction, codenamed Bull Mountain.
Ivy Bridge features and performance
- F16C.
- RDRAND instruction.
- PCI Express 3.0 support.
- Max CPU multiplier of 63.
- RAM support up to 2800 MT/s in 200 MHz increments.
- The built-in GPU has 6 or 16 execution units, compared to Sandy Bridge's 6 or 12.
- Intel HD Graphics with DirectX 11, OpenGL 4.0, and OpenCL 1.2 support on Windows. On Linux OpenGL 4.2 is supported as of Mesa 17.1.
- DDR3L and configurable TDP for mobile processors.
- Multiple 4K video playback.
- Intel Quick Sync Video version 2.
- Up to three displays are supported.
- A 14- to 19-stage instruction pipeline, depending on the micro-operation cache hit or miss.
Benchmark comparisons
- 3% to 6% increase in CPU performance when compared clock for clock
- 25% to 68% increase in integrated GPU performance.
Thermal performance and heat issues when overclocking
Enthusiast reports describe the TIM used by Intel as low-quality, and not up to par for a "premium" CPU, with some speculation that this is by design to encourage sales of prior processors. Further analyses caution that the processor can be damaged or void its warranty if home users attempt to remedy the matter. The TIM has much lower thermal conductivity, causing heat to trap on the die. Experiments with replacing this TIM with a higher-quality one or other heat removal methods showed a substantial temperature drop, and improvements to the increased voltages and overclocking sustainable by Ivy Bridge chips.
Intel claims that the smaller die of Ivy Bridge and the related increase in thermal density is expected to result in higher temperatures when the CPU is overclocked; Intel also stated that this is as expected and will likely not improve in future revisions.
Models and steppings
All Ivy Bridge processors with one, two, or four cores report the same CPUID model 0x000306A9, and are built in four different configurations differing in the number of cores, L3 cache and GPU execution units.Die code name | CPUID | Stepping | Die size | Die dimensions | Transistors | Cores | GPU EUs | L3 cache | Sockets |
Ivy Bridge-M-2 | 0x000306A9 | P0 | 94 mm2 | 7.656 x 12.223 mm | ~634 million | 2 | 6 | 3 MB | LGA 1155, Socket G2, BGA-1224, BGA-1023, BGA-1284 |
Ivy Bridge-H-2 | 0x000306A9 | L1 | 118 mm2 | 8.141 x 14.505 mm | ~830 million | 2 | 16 | 4 MB | LGA 1155, Socket G2, BGA-1224, BGA-1023, BGA-1284 |
Ivy Bridge-HM-4 | 0x000306A9 | N0 | 133 mm2 | 7.656 x 17.349 mm | ~1008 million | 4 | 6 | 6 MB | LGA 1155, Socket G2, BGA-1224, BGA-1023, BGA-1284 |
Ivy Bridge-HE-4 | 0x000306A9 | E1 | 160 mm2 | 8.141 x 19.361 mm | ~1400 million | 4 | 16 | 8 MB | LGA 1155, Socket G2, BGA-1224, BGA-1023, BGA-1284 |
Ivy Bridge-E/EN/EP/EX features
Ivy Bridge-E family is the follow-up to Sandy Bridge-E, using the same CPU core as the Ivy Bridge processor, but in LGA 2011, LGA 1356 and LGA 2011-1 packages for workstations and servers.- Dual memory controllers for Ivy Bridge-EP and Ivy Bridge-EX
- Up to 12 CPU cores and 30 MB of L3 cache for Ivy Bridge-EP
- Up to 15 CPU cores and 37.5 MB L3 cache for Ivy Bridge-EX
- Thermal design power between 50 W and 155 W
- Support for up to eight DIMMs of DDR3-1866 memory per socket, with reductions in memory speed depending on the number of DIMMs per channel
- No integrated GPU
- Ivy Bridge-EP introduced new hardware support for interrupt virtualization, branded as APICv.
Models and steppings
Ivy Bridge-EN is the model for single- and dual-socket servers using LGA 1356 with up to 10 cores, while Ivy Bridge-EP scales up to four LGA 2011 sockets and up to 12 cores per chip.
There are in fact three die "flavors" for the Ivy Bridge-EP, meaning that they are manufactured and organized differently, according to the number of cores an Ivy Bridge-EP CPU includes:
- The largest is an up-to-12-core die organized as three four-core columns with up to 30 MB L3 cache in two banks between the cores; these cores are linked by three rings of interconnects.
- The intermediate is an up-to-10-core die organized as two five-core columns with up to 25 MB L3 cache in a single bank between the cores; the cores are linked by two rings of interconnects.
- The smallest is an up-to-six-core die organized as two three-core columns with up to 15 MB L3 cache in a single bank between the cores; the cores are linked by two rings of interconnects.
Die code name | CPUID | Stepping | Die size | Transistors | Cores | L3 cache | Socket |
Ivy Bridge-E-6 | 0x0306Ex | S1 | 256.5 mm² | 1.86 billion | 6 | 15 MB | LGA 2011 |
Ivy Bridge-EN-6 | 0x0306Ex | S1 | 256.5 mm² | 1.86 billion | 6 | 15 MB | LGA 1356 |
Ivy Bridge-EP-6 | 0x0306Ex | S1 | 256.5 mm² | 1.86 billion | 6 | 15 MB | LGA 2011 |
Ivy Bridge-EX-6 | 0x0306Ex | D1 | 256.5 mm² | 1.86 billion | 6 | 15 MB | LGA 2011-1 |
Ivy Bridge-EN-10 | 0x0306Ex | M1 | 341 mm² | 2.89 billion | 10 | 25 MB | LGA 1356 |
Ivy Bridge-EP-10 | 0x0306Ex | M1 | 341 mm² | 2.89 billion | 10 | 25 MB | LGA 2011 |
Ivy Bridge-EX-10 | 0x0306Ex | D1 | 341 mm² | 2.89 billion | 10 | 25 MB | LGA 2011-1 |
Ivy Bridge-EP-12 | 0x0306Ex | C1 | 541 mm² | 4.31 billion | 12 | 30 MB | LGA 2011 |
Ivy Bridge-EX-15 | 0x0306Ex | D1 | 541 mm² | 4.31 billion | 15 | 37.5 MB | LGA 2011-1 |
Code name | Brand name | Cores | L3 cache | Socket | TDP | I/O Bus |
Ivy Bridge-E | Core i7-48xx | 4 | 10 MB | 1×LGA 2011 | 130 W | DMI |
Ivy Bridge-E | Core i7-49xx | 6 | 12–15 MB | 1×LGA 2011 | 130 W | DMI |
Ivy Bridge-EN | Xeon E5-14xx v2 | 4–6 | 10–15 MB | 1×LGA 1356 | 60–80 W | DMI |
Ivy Bridge-EN | Xeon E5-24xx v2 | 4–10 | 10–25 MB | 2×LGA 1356 | 50–95 W | DMI+QPI |
Ivy Bridge-EN | Pentium 14xx v2 | 2 | 6 MB | 1×LGA 1356 | 40–80 W | DMI |
Ivy Bridge-EP | Xeon E5-16xx v2 | 4–8 | 10–15 MB | 1×LGA 2011 | 130 W | DMI |
Ivy Bridge-EP | Xeon E5-26xx v2 | 4–12 | 10–30 MB | 2×LGA 2011 | 80–150 W | DMI+2×QPI |
Ivy Bridge-EP | Xeon E5-26xxL v2 | 6–10 | 15–25 MB | 2×LGA 2011 | 50–70 W | DMI+2×QPI |
Ivy Bridge-EP | Xeon E5-46xx v2 | 4–12 | 10–30 MB | 4×LGA 2011 | 70–130 W | DMI+2×QPI |
Ivy Bridge-EX | Xeon E7-28xx v2 | 12-15 | 24–37.5 MB | 2×LGA 2011-1 | 105–155 W | DMI+3×QPI |
Ivy Bridge-EX | Xeon E7-48xx v2 | 6-15 | 12–37.5 MB | 4×LGA 2011-1 | 105–155 W | DMI+3×QPI |
Ivy Bridge-EX | Xeon E7-88xx v2 | 6-15 | 24–37.5 MB | 8×LGA 2011-1 | 105–155 W | DMI+3×QPI |
List of Ivy Bridge processors
Processors featuring Intel's HD 4000 graphics are set in bold. Other processors feature HD 2500 graphics or HD Graphics unless indicated by N/A.Desktop processors
List of announced desktop processors, as follows:- Requires a compatible motherboard.
- K Unlocked
- S Performance-optimized lifestyle
- T Power-optimized lifestyle
- P No on-die video chipset
- X Extreme performance
Server processors
The Ivy Bridge-EP processor line announced in September 2013 has up to 12 cores and 30 MB third level cache, with rumors of Ivy Bridge-EX up to 15 cores and an increased third level cache of up to 37.5 MB, although an early leaked lineup of Ivy Bridge-E included processors with a maximum of 6 cores.
Both Core-i7 and Xeon versions are produced: the Xeon versions marketed as Xeon E5-1400 V2 act as drop-in replacements for the existing Sandy Bridge-EN based Xeon E5, Xeon E5-2600 V2 versions act as drop-in replacements for the existing Sandy Bridge-EP based Xeon E5, while Core-i7 versions designated i7-4820K, i7-4930K and i7-4960X were released on September 10, 2013, remaining compatible with the X79 and LGA 2011 hardware.
For the intermediate LGA 1356 socket, Intel launched the Xeon E5-2400 V2 series in January 2014. These have up to 10 cores.
A new Ivy Bridge-EX line marketed as Xeon E7 V2 had no corresponding predecessor using the Sandy Bridge microarchitecture but instead followed the older Westmere-EX processors.
- Requires a compatible motherboard.
Mobile processors
Suffixes to denote:- M Mobile processor
- Q Quad-core
- U Ultra-low power
- X "Extreme"
- Y Extreme ultra-low power
Roadmap