List of AMD mobile microprocessors

Features overview

CPUs

APUs

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

AMD mobile	Initial platform
Mobile processor	Processors - Socket 754 Mobile Sempron single-core 32-bit processor, or Mobile Athlon 64 single-core 64-bit processor, or Turion 64 single-core 64-bit processor
Mobile chipset	D-sub and HyperTransport 1.0

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 2600+	1600 MHz	128 kB	800 MHz	8x	0.95 - 1.4 V	13 - 62 W	July 28, 2004	SMN2600BIX2AY
Mobile Sempron 2800+	1600 MHz	256 kB	800 MHz	8x	0.95 - 1.4 V	13 - 62 W	July 28, 2004	SMN2800BIX3AY
Mobile Sempron 3000+	1800 MHz	128 kB	800 MHz	9x	0.95 - 1.4 V	13 - 62 W	July 28, 2004	SMN3000BIX2AY

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 2600+	1600 MHz	128 kB	800 MHz	8x	0.975 - 1.25 V	9 - 25 W	July 28, 2004	SMS2600BOX2LA
Mobile Sempron 2800+	1600 MHz	256 kB	800 MHz	8x	0.975 - 1.25 V	9 - 25 W	July 28, 2004	SMS2800BOX3LA

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 2600+	1600 MHz	128 kB	800 MHz	8x	0.95 - 1.4 V	62 W	July 2004	SMN2600BIX2BA
Mobile Sempron 2800+	1600 MHz	256 kB	800 MHz	8x	0.95 - 1.4 V	62 W	July 2004	SMN2800BIX3BA
Mobile Sempron 3000+	1800 MHz	128 kB	800 MHz	9x	0.95 - 1.4 V	62 W	July 2004	SMN3000BIX2BA
Mobile Sempron 3100+	1800 MHz	256 kB	800 MHz	9x	0.95 - 1.4 V	62 W	May 3, 2005	SMN3100BIX3BA
Mobile Sempron 3300+	2000 MHz	128 kB	800 MHz	10x	0.95 - 1.4 V	62 W	August 19, 2005	SMN3300BIX2BA

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 2600+	1600 MHz	128 kB	800 MHz	8x	0.975 - 1.25 V	25 W	July 2004	SMS2600BOX2LB
Mobile Sempron 2800+	1600 MHz	256 kB	800 MHz	8x	0.975 - 1.25 V	25 W	July 2004	SMS2800BOX3LB
Mobile Sempron 3000+	1800 MHz	128 kB	800 MHz	9x	0.975 - 1.25 V	25 W	November 23, 2004	SMS3000BOX2LB
Mobile Sempron 3100+	1800 MHz	256 kB	800 MHz	9x	0.975 - 1.25 V	25 W	January 2005	SMS3100BOX3LB

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 3000+	1800 MHz	128 kB	800 MHz	9x	0.95 - 1.4 V	62 W	July 15, 2005	SMN3000BIX2BX
Mobile Sempron 3100+	1800 MHz	256 kB	800 MHz	9x	0.95 - 1.4 V	62 W	July 15, 2005	SMN3100BIX3BX
Mobile Sempron 3300+	2000 MHz	128 kB	800 MHz	10x	0.95 - 1.4 V	62 W	July 15, 2005	SMN3300BIX2BX
Mobile Sempron 3400+	2000 MHz	256 kB	800 MHz	10x	0.95 - 1.4 V	62 W	January 23, 2006	SMN3400BIX3BX
Mobile Sempron 3600+	2200 MHz	128 kB	800 MHz	11x	0.95 - 1.4 V	62 W	May 17, 2006	SMN3600BIX2BX

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 2800+	1600 MHz	256 kB	800 MHz	8x	0.95 - 1.2 V	25 W	July 15, 2005	SMS2800BQX3LF
Mobile Sempron 3000+	1800 MHz	128 kB	800 MHz	9x	0.95 - 1.2 V	25 W	July 15, 2005	SMS3000BQX2LE SMS3000BQX2LF
Mobile Sempron 3100+	1800 MHz	256 kB	800 MHz	9x	0.95 - 1.2 V	25 W	July 15, 2005	SMS3100BQX3LE
Mobile Sempron 3300+	2000 MHz	128 kB	800 MHz	10x	0.95 - 1.2 V	25 W	July 2005	SMS3300BQX2LE
Mobile Sempron 3400+	2000 MHz	256 kB	800 MHz	10x	0.95 - 1.2 V	25 W	May 17, 2006	SMS3400BQX3LE

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2700+	1600 MHz	512 kB	800 MHz	8x	1.50 V	19 - 81.5 W	Socket 754	May 2004	AMA2700BEY4AP
Mobile Athlon 64 2800+	1600 MHz	1024 kB	800 MHz	8x	1.50 V	19 - 81.5 W	Socket 754	February 2004	AMA2800BEX5AP AMA2800BEX5AR
Mobile Athlon 64 3000+	1800 MHz	1024 kB	800 MHz	9x	1.50 V	19 - 81.5 W	Socket 754	September 2003	AMA3000BEX5AP AMA3000BEX5AR
Mobile Athlon 64 3200+	2000 MHz	1024 kB	800 MHz	10x	1.50 V	19 - 81.5 W	Socket 754	September 2003	AMA3200BEX5AP AMA3200BEX5AR
Mobile Athlon 64 3400+	2200 MHz	1024 kB	800 MHz	11x	1.50 V	19 - 81.5 W	Socket 754	September 2003	AMA3400BEX5AP AMA3400BEX5AR
Mobile Athlon 64 3700+	2400 MHz	1024 kB	800 MHz	12x	1.50 V	19 - 81.5 W	Socket 754	September 2003	AMA3700BEX5AP AMA3700BEX5AR

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2800+	1600 MHz	1024 kB	800 MHz	8x	1.40 V	62 W	Socket 754	September 2003	AMN2800BIX5AP AMN2800BIX5AR
Mobile Athlon 64 3000+	1800 MHz	1024 kB	800 MHz	9x	1.40 V	62 W	Socket 754	September 2003	AMN3000BIX5AP AMN3000BIX5AR
Mobile Athlon 64 3200+	2000 MHz	1024 kB	800 MHz	10x	1.40 V	62 W	Socket 754	September 2003	AMN3200BIX5AP AMN3200BIX5AR
Mobile Athlon 64 3400+	2200 MHz	1024 kB	800 MHz	11x	1.40 V	62 W	Socket 754	February 2004	AMN3400BIX5AR

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2700+	1600 MHz	512 kB	800 MHz	8x	1.20 V	35 W	Socket 754	May 2004	AMD2700BQX4AR

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2800+	1800 MHz	512 kB	800 MHz	8x	1.50 V	19 - 81.5 W	Socket 754	April 2004	AMA2800BEX4AX

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2700+	1600 MHz	512 kB	800 MHz	8×	1.20 V	35 W	Socket 754	May 2004	AMD2700BQX4AX
Mobile Athlon 64 2800+	1800 MHz	512 kB	800 MHz	9×	1.20 V	35 W	Socket 754	May 2004	AMD2800BQX4AX
Mobile Athlon 64 3000+	2000 MHz	512 kB	800 MHz	10×	1.20 V	35 W	Socket 754	May 2004	AMD3000BQX4AX

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 2700+	1600 MHz	512 kB	800 MHz	8×	1.35 V	35 W	Socket 754	August 17, 2004	AMD2700BKX4LB
Mobile Athlon 64 2800+	1800 MHz	512 kB	800 MHz	9×	1.35 V	35 W	Socket 754	August 17, 2004	AMD2800BKX4LB
Mobile Athlon 64 3000+	2000 MHz	512 kB	800 MHz	10×	1.35 V	35 W	Socket 754	August 17, 2004	AMD3000BKX4LB

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Socket	Release Date	Part Number
Mobile Athlon 64 3000+	1800 MHz	1024 kB	800 MHz	9×	1.35 V	62 W	Socket 754	April 14, 2005	AMN3000BKX5BU
Mobile Athlon 64 3200+	2000 MHz	1024 kB	800 MHz	10×	1.35 V	62 W	Socket 754	April 14, 2005	AMN3200BKX5BU
Mobile Athlon 64 3400+	2200 MHz	1024 kB	800 MHz	11×	1.35 V	62 W	Socket 754	April 14, 2005	AMN3400BKX5BU
Mobile Athlon 64 3700+	2400 MHz	1024 kB	800 MHz	12×	1.35 V	62 W	Socket 754	April 14, 2005	AMN3700BKX5BU
Mobile Athlon 64 4000+	2600 MHz	1024 kB	800 MHz	13×	1.35 V	62 W	Socket 754	August 16, 2005	AMN4000BKX5BU

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion 64 ML-28	1600 MHz	512 kB	800 MHz	8x	1.35 V	35 W	Socket 754	June 22, 2005	TMDML28BKX4LD
Turion 64 ML-30	1600 MHz	1024 kB	800 MHz	8x	1.35 V	35 W	Socket 754	March 10, 2005	TMDML30BKX5LD
Turion 64 ML-32	1800 MHz	512 kB	800 MHz	9x	1.35 V	35 W	Socket 754	March 10, 2005	TMDML32BKX4LD
Turion 64 ML-34	1800 MHz	1024 kB	800 MHz	9x	1.35 V	35 W	Socket 754	March 10, 2005	TMDML34BKX5LD
Turion 64 ML-37	2000 MHz	1024 kB	800 MHz	10x	1.35 V	35 W	Socket 754	March 10, 2005	TMDML37BKX5LD
Turion 64 ML-40	2200 MHz	1024 kB	800 MHz	11x	1.35 V	35 W	Socket 754	June 22, 2005	TMDML40BKX5LD
Turion 64 ML-42	2400 MHz	512 kB	800 MHz	12x	1.35 V	35 W	Socket 754	October 4, 2005	TMDML42BKX4LD
Turion 64 ML-44	2400 MHz	1024 kB	800 MHz	12x	1.35 V	35 W	Socket 754	January 4, 2006	TMDML44BKX5LD
Turion 64 MT-28	1600 MHz	512 kB	800 MHz	8x	1.20 V	25 W	Socket 754	June 22, 2005	TMSMT28BQX4LD
Turion 64 MT-30	1600 MHz	1024 kB	800 MHz	8x	1.20 V	25 W	Socket 754	March 10, 2005	TMSMT30BQX5LD
Turion 64 MT-32	1800 MHz	512 kB	800 MHz	9x	1.20 V	25 W	Socket 754	March 10, 2005	TMSMT32BQX4LD
Turion 64 MT-34	1800 MHz	1024 kB	800 MHz	9x	1.20 V	25 W	Socket 754	March 10, 2005	TMSMT34BQX5LD
Turion 64 MT-37	2000 MHz	1024 kB	800 MHz	10x	1.20 V	25 W	Socket 754	August 8, 2005	TMSMT37BQX5LD
Turion 64 MT-40	2200 MHz	1024 kB	800 MHz	11x	1.20 V	25 W	Socket 754	August 8, 2005	TMSMT40BQX5LD

Kite platform (2006)

Introduced in 2006, the Kite platform consists of:

AMD mobile	Kite platform
Mobile processor	Processors - Socket S1 Mobile Sempron single-core 64-bit processor, or Turion 64 single-core 64-bit processor, or Turion 64 X2 dual-core 64-bit processor
Mobile chipset	DVI and HyperTransport 1.0 DDR2-667 SO-DIMM
Mobile support	Wireless IEEE 802.11 b/g mini-PCI Express WiFi adapter

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Mobile Sempron 3200+	1600 MHz	512 kB	800 MHz	8x	0.950 - 1.125 V	25 W	May 17, 2006	SMS3200HAX4CM
Mobile Sempron 3400+	1800 MHz	256 kB	800 MHz	9x	0.950 - 1.125 V	25 W	May 17, 2006	SMS3400HAX3CM
Mobile Sempron 3500+	1800 MHz	512 kB	800 MHz	9x	0.950 - 1.125 V	25 W	May 17, 2006	SMS3500HAX4CM
Mobile Sempron 3600+	2000 MHz	256 kB	800 MHz	10x	0.950 - 1.125 V	25 W	Oct 23, 2006	SMS3600HAX3CM

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion 64 MK-36	2000 MHz	512 kB	800 MHz	10x	1.15 V	31 W	Socket S1	September 1, 2006	TMDMK36HAX4CM
Turion 64 MK-38	2200 MHz	512 kB	800 MHz	11x	1.15 V	31 W	Socket S1	Q1 2007	TMDMK38HAX4CM

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion 64 X2 TL-50	1600 MHz	2 × 256 kB	800 MHz	8x	0.8 - 1.10 V	31 W	Socket S1	May 17, 2006	TMDTL50HAX4CT

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion 64 X2 TL-52	1600 MHz	2 × 512 kB	800 MHz	8x	0.8 - 1.125 V	31 W	Socket S1	May 17, 2006	TMDTL52HAX5CT
Turion 64 X2 TL-56	1800 MHz	2 × 512 kB	800 MHz	9x	0.8 - 1.125 V	33 W	Socket S1	May 17, 2006	TMDTL56HAX5CT
Turion 64 X2 TL-60	2000 MHz	2 × 512 kB	800 MHz	10x	0.8 - 1.125 V	35 W	Socket S1	May 17, 2006	TMDTL60HAX5CT
Turion 64 X2 TL-64	2200 MHz	2 × 512 kB	800 MHz	11x	0.8 - 1.125 V	35 W	Socket S1	January 30, 2007	TMDTL64HAX5CT

Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

AMD mobile	Kite Refresh platform
Mobile processor	Processors - Socket S1 Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm, or Mobile Sempron single-core 64-bit processor 65 nm
Mobile chipset	HDMI, HyperTransport 1.0 and PCI Express 1.0 DDR2-800 SO-DIMM
Mobile support	Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter Hybrid hard drives Alert Standard Format 2.0 Trusted Platform Module

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Model Number	Frequency	L2 Cache	HyperTransport	Mult.²	Voltage	TDP	Release Date	Part Number
Sempron 2100+ fanless	1000 MHz	256 kB	800 MHz	5x	0.950 - 1.125 V	9 W	May 30, 2007	SMF2100HAX3DQE
Mobile Sempron 3600+	2000 MHz	256 kB	800 MHz	10x		25 W		SMS3600HAX3DN
Mobile Sempron 3700+	2000 MHz	512 kB	800 MHz	10x		25 W		SMS3700HAX4DQE
Mobile Sempron 3800+	2200 MHz	256 kB	800 MHz	11x		31 W		SMD3800HAX3DN
Mobile Sempron 4000+	2200 MHz	512 kB	800 MHz	11x		31 W		SMD4000HAX4DN

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Athlon 64 X2 TK-42	1600 MHz	2 × 512 kB	800 MHz	8.0x	1.075/1.10/1.125 V	20 W	Socket S1		AMETK42HAX5DM
Athlon 64 X2 TK-53	1700 MHz	2 × 256 kB	800 MHz	8.5x	1.075/1.10/1.125 V	31 W	Socket S1	August 20, 2007	AMDTK53HAX4DC
Athlon 64 X2 TK-55	1800 MHz	2 × 256 kB	800 MHz	9.0x	1.075/1.10/1.125 V	31 W	Socket S1	Aug 20 2007	AMDTK55HAX4DC
Athlon 64 X2 TK-57	1900 MHz	2 × 256 kB	800 MHz	9.5x	1.075/1.10/1.125 V	31 W	Socket S1	2008	AMDTK57HAX4DM

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion 64 X2 TL-56	1800 MHz	2 × 512 kB	800 MHz	9.0x	1.075/1.10/1.125 V	31 W	Socket S1	May 7, 2007	TMDTL56HAX5DC
Turion 64 X2 TL-58	1900 MHz	2 × 512 kB	800 MHz	9.5x	1.075/1.10/1.125 V	31 W	Socket S1	May 7, 2007	TMDTL58HAX5DC
Turion 64 X2 TL-60	2000 MHz	2 × 512 kB	800 MHz	10.0x	1.075/1.10/1.125 V	31 W	Socket S1	May 7, 2007	TMDTL60HAX5DC
Turion 64 X2 TL-62	2100 MHz	2 × 512 kB	800 MHz	10.5x	1.075/1.10/1.125 V	35 W	Socket S1	Jan 21 2008	TMDTL62HAX5DM
Turion 64 X2 TL-64	2200 MHz	2 × 512 kB	800 MHz	11.0x	1.075/1.10/1.125 V	35 W	Socket S1	May 7, 2007	TMDTL64HAX5DC
Turion 64 X2 TL-66	2300 MHz	2 × 512 kB	800 MHz	11.5x	1.075/1.10/1.125 V	35 W	Socket S1	May 7, 2007 Jul 10 2007	TMDTL66HAX5DC TMDTL66HAX5DM
Turion 64 X2 TL-68	2400 MHz	2 × 512 kB	800 MHz	12.0x	1.075/1.10/1.125 V	35 W	Socket S1	December 19, 2007	TMDTL68HAX5DM

Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or Mobile Sempron single-core 64-bit processor, with the following: * Split-power planes and linked power management support * Support for possible low voltage processors
Mobile chipset	AMD M780 series chipset Mobility Radeon HD 3000 series GPU on 55 nm process * ATI Hybrid Graphics * Hybrid CrossFire * PowerXpress HyperFlash - memory modules on motherboard with ReadyBoost DisplayPort, HyperTransport 3.0 and PCI Express 2.0 support DDR2-800 SO-DIMM
Mobile support	Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter Hybrid hard drives Desktop and mobile Architecture for System Hardware 1.0 support Trusted Platform Module support

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Sempron SI-40	2000 MHz	512 kB	1800 MHz	10.0x	1.075 - 1.125 V	25 W	Socket S1G2	June 4, 2008	SMSI40SAM12GG
Sempron SI-42	2100 MHz	512 kB	1800 MHz	10.5x	1.075 - 1.125 V	25 W	Socket S1G2	Q3 2008	SMSI42SAM12GG

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Athlon X2 QL-60	1900 MHz	2 × 512 kB	1800 MHz	9.5x	0.95 - 1.1 V	35 W	Socket S1G2	June 4, 2008	AMQL60DAM22GG
Athlon X2 QL-62	2000 MHz	2 × 512 kB	1800 MHz	10.0x	0.95 - 1.1 V	35 W	Socket S1G2	Q3 2008	AMQL62DAM22GG
Athlon X2 QL-64	2100 MHz	2 × 512 kB	1800 MHz	10.5x	0.95 - 1.1 V	35 W	Socket S1G2	Q4 2008	AMQL64DAM22GG
Athlon X2 QL-65	2100 MHz	2 × 512 kB	2000 MHz	10.5x	0.95 - 1.1 V	35 W	Socket S1G2	Q4 2008	AMQL65DAM22GG
Athlon X2 QL-66	2200 MHz	2 × 512 kB	1800 MHz	11.0x	0.95 - 1.1 V	35 W	Socket S1G2	Q4 2008	AMQL66DAM22GG
Athlon X2 QL-67	2200 MHz	2 × 512 kB	2000 MHz	11.0x	0.95 - 1.1 V	35 W	Socket S1G2	Q4 2008	AMQL67DAM22GG

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion X2 RM-70	2000 MHz	2 × 512 kB	1800 MHz	10x	0.75 - 1.2 V	31 W	Socket S1G2	June 4, 2008	TMRM70DAM22GG
Turion X2 RM-72	2100 MHz	2 × 512 kB	1800 MHz	10.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q3 2008	TMRM72DAM22GG
Turion X2 RM-74	2200 MHz	2 × 512 kB	1800 MHz	11.0x	0.75 - 1.2 V	35 W	Socket S1G2	Q4 2008	TMRM74DAM22GG
Turion X2 RM-75	2200 MHz	2 × 512 kB	2000 MHz	11.0x	0.75 - 1.2 V	35 W	Socket S1G2	Q4 2008	TMRM75DAM22GG
Turion X2 RM-76	2300 MHz	2 × 512 kB	1800 MHz	11.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q4 2008	TMRM76DAM22GG
Turion X2 RM-77	2300 MHz	2 × 512 kB	2000 MHz	11.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q4 2008	TMRM77DAM22GG

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion X2 Ultra ZM-80	2100 MHz	2 × 1 MB	1800 MHz	10.5x	0.75 - 1.2 V	32 W	Socket S1G2	June 4, 2008	TMZM80DAM23GG
Turion X2 Ultra ZM-82	2200 MHz	2 × 1 MB	1800 MHz	11.0x	0.75 - 1.2 V	35 W	Socket S1G2	June 4, 2008	TMZM82DAM23GG
Turion X2 Ultra ZM-84	2300 MHz	2 × 1 MB	1800 MHz	11.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q3 2008	TMZM84DAM23GG
Turion X2 Ultra ZM-85	2300 MHz	2 × 1 MB	2200 MHz	11.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q3 2008	TMZM85DAM23GG
Turion X2 Ultra ZM-86	2400 MHz	2 × 1 MB	1800 MHz	12.0x	0.75 - 1.2 V	35 W	Socket S1G2	June 4, 2008	TMZM86DAM23GG
Turion X2 Ultra ZM-87	2400 MHz	2 × 1 MB	2200 MHz	12.0x	0.75 - 1.2 V	35 W	Socket S1G2	Q3 2008	TMZM87DAM23GG
Turion X2 Ultra ZM-88	2500 MHz	2 × 1 MB	1800 MHz	12.5x	0.75 - 1.2 V	35 W	Socket S1G2	Q3 2008	TMZM88DAM23GG

Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009 with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile	Initial platform
Mobile processor	Processors Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or Mobile Sempron single-core 64-bit processor, with the following: * 27 mm × 27 mm × 2.5 mm BGA package, named "ASB1" * low voltage processors
Mobile chipset	AMD RS690E series chipset + SB600 southbridge Mobility Radeon HD 3000 series GPU on 55 nm process DDR2 SO-DIMM
Mobile support	Wireless connectivity with 3G Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter

Sempron

"Huron" (65 nm, Low power)

Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
Sempron 210U supports extra AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Package/Socket	Release date	Order Part Number
Sempron 200U	1000 MHz	256 kB	1600 MHz	5x	0.925 V	8 W	Socket ASB1	January 8, 2009	SMF200UOAX3DV
Sempron 210U	1500 MHz	256 kB	1600 MHz	7.5x	0.925 V	15 W	Socket ASB1	January 8, 2009	SMG210UOAX3DX

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Package	Release Date	Part Number
Athlon Neo MV-40	1600 MHz	512 kB	800 MHz	8x	1.1 V	15 W	Socket ASB1	January 8, 2009	AMGMV40OAX4DX

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Package	Release Date	Part Number
Athlon Neo TF-20	1600 MHz	512 kB	800 MHz	8x	1.0 V	15 W	Socket S1	January 8, 2009	AMGTF20HAX4DN

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Package	Release Date	Part Number
Athlon Mobile X2 L310	1200 MHz	2 × 512 kB	800 MHz	6x	0.925 V	13 W	Socket S1	January 8, 2009	AMML310HAX5DM

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	V_Core	TDP	Package	Release Date	Part Number
Turion Mobile X2 L510	1600 MHz	2 × 512 kB	800 MHz	8x	0.925 V	20 W	Socket S1	January 8, 2009	TMEL510HAX5DM

Congo platform (2009)

The Congo platform was introduced on September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile	Initial platform
Mobile processor	Processors Single or Dual-core 64-bit processors codenamed Conesus, with the following: * made on 65 nm process * 15 W or 18 W TDP * 27 mm × 27 mm × 2.5 mm BGA package, named "ASB1" * low voltage processors * DDR2 SO-DIMM
Mobile chipset	AMD M780G series chipset + SB710 southbridge Mobility Radeon HD 3200 GPU on 55 nm process * RV610 graphics core * DirectX 10.0 * UVD

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Athlon Neo X2 L325	1500 MHz	2 × 512 kB	800 MHz	7.5x	0.925 V	18 W	Socket ASB1	August 10, 2009	AMZL325OAX5DY
Athlon Neo X2 L335	1600 MHz	2 × 512 kB	800 MHz	8.0x	0.925 V	18 W	Socket ASB1	February 2010	AMZL335OAX5DY

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Model Number	Frequency	L2 Cache	HT	Mult.¹	Voltage	TDP	Socket	Release date	Order Part Number
Turion Neo X2 L625	1600 MHz	2 × 512 kB	800 MHz	8x	0.925 V	18 W	Socket ASB1	August 10, 2009	TMZL625OAX5DY

Tigris platform (2009)

The Tigris platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Single or Dual-core 64-bit processors codenamed Caspian, with the following: * made on 45 nm process * 25 W or 35 W TDP
Mobile chipset	AMD M785 series chipset + SB710 southbridge Mobility Radeon HD 4200 GPU on 55 nm process * RV620 graphics core * DirectX 10.1 * UVD 2

Sempron

"Caspian" (45 nm)

Single-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Athlon II

"Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion II

"Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Nile platform (2010)

The Nile platform introduced on May 12, 2010 for the third AMD Ultrathin Platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Single or Dual-core 64-bit processors codenamed Geneva, with the following: * made on 45 nm process * support for DDR3 memory * 9 W, 12 W or 15 W TDP
Mobile chipset	AMD RS880 series chipset + SB850 southbridge Mobility Radeon HD 42xx GPU on 55 nm process * RV620 graphics core * DirectX 10.1 * UVD 2

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Memory support: DDR3 SDRAM, DDR3L SDRAM

V series

"Geneva" (45 nm)

Single-core mobile processor

Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor
Single-core mobile processor
Dual-core mobile processor

Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

Danube platform (2010)

The Danube platform introduced on May 12, 2010 for the AMD Mainstream Notebook Platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following: * made on 45 nm process * support for DDR3 memory * 25, 35 or 45 W TDP
Mobile chipset	AMD RS880 series chipset + SB850 southbridge Mobility Radeon HD 42xx GPU on 55 nm process * RV620 graphics core * DirectX 10.1 * UVD 2

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Memory support: DDR3 SDRAM, DDR3L SDRAM

V series

Champlain (45 nm)

Single-core mobile processor

Athlon II

Champlain (45 nm)

Dual-core mobile processor

Turion II

Champlain (45 nm)

Dual-core mobile processor

Phenom II

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Unlike desktop models, mobile Phenom II-based models do not have L3 cache
Memory support: DDR3 SDRAM, DDR3L SDRAM
Champlain (45 nm)

Dual-core mobile processor
Triple-core mobile processors
Quad-core mobile processors

Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario and Zacate APUs.
Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute and OpenCL. Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Single or Dual-core 64-bit AMD Accelerated Processing Unit APU codenamed Ontario, Zacate and with the following: * Bobcat cores made on 40 nm CMOS process * support for DDR3 1066 or 1333 MHz memory * 9 W or 18 W TDP Radeon HD 6xxx GPU on 40 nm process * Cedar graphics core with 80 SP * DirectX 11 * UVD 3
Mobile chipset	A50M

"''Ontario''" (40 nm)

SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V

Memory support: DDR3 SDRAM, DDR3L SDRAM

2.5 GT/s UMI.

Config GPU are Unified shaders : Texture mapping units : Render output units

Socket FT1

"''Zacate''" (40 nm)

SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V

Memory support: DDR3 SDRAM, DDR3L SDRAM

2.5 GT/s UMI.

Config GPU are Unified shaders : Texture mapping units : Render output units

Socket FT1

Sabine (Fusion) platform (2011)

The Sabine platform introduced on June 30, 2011 for the AMD Mainstream Notebook Platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the following: * made on 32 nm process * support for DDR3 1600 MHz memory * 35 W or 45 W TDP Radeon HD 6xxxG GPU on 32 nm process * Sumo graphics core with up to 400 SP * DirectX 11 * UVD 3
Mobile chipset	A60M, A70M

"''Llano''" (32 nm)

SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core

Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified

2.5 GT/s UMI.

Transistors: 1.148 billion

Die size: 228 mm²

¹ Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate APUs.
This platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Dual-core 64-bit AMD Accelerated Processing Unit APU codenamed Zacate and with the following: * Bobcat cores made on 40 nm CMOS process * support for DDR3 1333 MHz memory * 18 W TDP Radeon HD 7xxx GPU on 40 nm process * Cedar graphics core with 80 SP * DirectX 11 * UVD 3
Mobile chipset	A68M

"''Ontario''", "''Zacate''" (40 nm)

SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V

Single-channel DDR3 SDRAM, DDR3L SDRAM

2.5 GT/s UMI.

Config GPU are Unified shaders : Texture mapping units : Render output units

Socket FT1

Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Dual or Quad-core 64-bit AMD Accelerated Processing Unit APU codenamed Trinity, and with the following: * Piledriver cores made on 32 nm process * support for DDR3 1600 MHz memory * 17 W, 25 W or 35 W TDP Radeon HD 7xxxG GPU on 32 nm process * Devastator graphics core with up to 384 SP * DirectX 11 * UVD 3.2
Mobile chipset	A70M

"''Trinity''" (2012, 32 nm)

MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core

Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified

2.5 GT/s UMI.

Transistors: 1.303 billion

Die size: 246 mm²

¹ Config GPU are Unified shaders : Texture mapping units : Render output units

"''Richland''" (2013, 32 nm)

Elite Performance APU.
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified
2.5 GT/s UMI.
Transistors: 1.303 billion
Die size: 246 mm²

¹ Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

''"Temash"'' (2013, 28 nm)

Elite Mobility APU:
¹ Unified shaders : Texture mapping units : Render output units

''"Kabini"'' (2013, 28 nm)

Mainstream APU:
¹ Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

Kaveri (2014)

Carrizo-L (2015)

Carrizo (2015)

Bristol Ridge (2016)

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